Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVC2802-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2602-1LLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVC2802-2MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2002-2MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE1752-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVE2002-1MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVC2602-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2302-2MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVC2802-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2802-2MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVH1742-1MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVE2102-1LSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVE2102-2LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625
XCVE2002-2MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVE1752-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVE2202-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784	e1
XCVE2102-1MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2102-2MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVE2002-2MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVC2602-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2102-1MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2102-1MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVE2102-1LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVC2802-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2102-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.7 V		S-PBGA-B784	e1
XCVE2602-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2202-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2102-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.7 V		S-PBGA-B784	e1
XCVE1752-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVE2802-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE1752-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVH1582-2LLEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B3697
XCVE2102-1LSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625
XCVE2102-2MLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2302-1MLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVH1542-2LLEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B3697
XCVE2302-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2102-2MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2202-2LLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784	e1
XCVE2802-1LLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2602-1LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2202-2MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVE2202-2MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVH1582-2MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVE2802-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVC2802-1MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.