Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1802-3LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1102-3DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3LLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1702-2GLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.88 V	.92 mm	S-PBGA-B2785
XCVP1402-2GSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2GSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1LSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1352-1HSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU28DR-L1FFRG1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1517	4	e0
XCVP1802-2LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1552-3MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3HLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1702-3MLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2DSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1102-2GLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1202-3HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3MSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1102-1GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVC1502-1HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3GLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1LLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.676 V	110 Cel	-40 Cel		BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.7 V	1 mm	S-PBGA-B4072
XCVC1802-3DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1552-2GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1402-3HLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XQZU21DR-2FFRD1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			20	220		CMOS	.85 V		S-PBGA-B1156	4	e0
XCVP1102-3LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2LLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1502-1DLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1HSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.