Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1552-3LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3GLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVP1102-2HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-1DLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1102-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1402-1GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z030-L2RF676I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		1 mm	S-PBGA-B676	4	e0
XCVC1902-2MLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-2GLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2HLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1502-2HSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1402-2MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1552-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1402-3HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1352-2LLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-3DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1702-3DLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1HLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2GLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1DLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2DSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1LLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1552-2DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3HLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3HLIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1802-2LSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1552-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3340
XCVP1402-1DLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3LSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1DLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1DSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.