Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1502-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1502-3GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1GSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1HSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3340
XCVC1352-1DSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3HSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1DLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2DSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1GLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-3MLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3GSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1102-2LLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3LSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2DSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU15EG-1FFRB1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVC1902-2DLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1DSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XQZU28DR-L1FFRE1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1156	4	e0
XCVC1902-3MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1902-3LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1DLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1HLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1552-2GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1802-1DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1402-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1702-3MSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XQZU5EV-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XCVP1552-2DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1802-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.88 V	.92 mm	S-PBGA-B1760
XCVC1702-1HLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1402-3MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.