Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code
XCVE2202-2HSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY	BGA784,28X28,31	.854 V	110 Cel	-40 Cel	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.88 V	.8 mm	S-PBGA-B784
XCVP1002-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVP2802-1MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1802-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP2502-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVE1752-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVP1052-1LLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP1002-1LSENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP2502-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1052-1LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP1702-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2502-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-3HSEVSVB3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel	BOTTOM				CMOS	.88 V		R-PBGA-B3340
XCVP1052-2LLENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP2802-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	-40 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1002-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVP1702-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2502-1MLIVSVB3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B3340
XCVP1402-2MSIVSVD2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B2197
XCVP1702-1MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP2502-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP1002-2MLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE1752-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVP2502-2LLEVSVB3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B3340
XCVE1752-2MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel	BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE2002-2HSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel	BOTTOM				CMOS	.88 V		S-PBGA-B484
XCVE2202-2LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784
XCVP2802-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1052-1MSINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVP1002-2MSIVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B2021
XCVP1002-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP2502-2MSEVSVB3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B3340
XCVE2102-2HSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel	BOTTOM				CMOS	.88 V		S-PBGA-B625
XCVE2802-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVP1002-2LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP1052-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVP1052-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP1802-1LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	100 Cel	0 Cel	BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP1052-1MSENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B1369
XCVP1002-1LLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVP2502-3HSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel	BOTTOM				CMOS	.88 V		R-PBGA-B5601
XCVP1702-2LSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVE2602-2LLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVP1702-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1052-2LSENFVI1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	BOTTOM				CMOS	.7 V		R-PBGA-B1369
XCVE2602-1MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE2802-2MLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	BOTTOM				CMOS	.8 V		S-PBGA-B1369

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.