Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVP1702-1MSIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA3340,58X58,36

.775 V

110 Cel

-40 Cel

BOTTOM

4.48 mm

55 mm

55 mm

CMOS

.8 V

.92 mm

S-PBGA-B3340

XCVP1802-2MLEVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA5601,75X75,36

.775 V

110 Cel

0 Cel

BOTTOM

4.55 mm

70 mm

70 mm

CMOS

.8 V

.92 mm

S-PBGA-B5601

XCVP1802-3DLILSVC4072

Xilinx

MICROPROCESSOR CIRCUIT

XCZU15EG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU15EG-L1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU17EG-1FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU17EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-3FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU19EG-L2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU1CG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L2UBVA494E

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU21DR-2FFVD1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU27DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU27DR-2FSVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU28DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU28DR-L2FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU2CG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

2.61 mm

19 mm

30

250

19 mm

CMOS

.85 V

.8 mm

R-PBGA-B484

4

e1

XCZU3EG-L1UBVA530I

Xilinx

PROGRAMMABLE SoC

30

245

4

XCZU42DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC

XCZU42DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC

XCZU43DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC

XCZU47DR-1FFVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU48DR-2FSVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU49DR-1FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-2FSVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU49DR-L2FFVF1760I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU4EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU65DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC

XCZU6CG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU6CG-3FFVB1156E

Xilinx

TIN SILVER COPPER

4

e1

XCZU7CG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7EG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EV-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XCZU9CG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z045-1RFG676Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

125 Cel

-40 Cel

BOTTOM

3.37 mm

27 mm

NOT SPECIFIED

NOT SPECIFIED

27 mm

CMOS

1 mm

S-PBGA-B676

XQZU7EV-1FFRB900M

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XQZU7EV-L1FFRB900I

Xilinx

PROGRAMMABLE SoC

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

GRID ARRAY

BGA900,30X30,40

.808 V

100 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

3.71 mm

31 mm

225

31 mm

CMOS

.85 V

1 mm

S-PBGA-B900

4

e0

XA7Z010-1CLG225Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

225

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA225,15X15,32

125 Cel

-40 Cel

TIN SILVER COPPER

N

BOTTOM

1.5 mm

13 mm

13 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B225

3

Not Qualified

e1

XCZU15EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU6CG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z100-1RF900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

BOTTOM

3.44 mm

31 mm

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 mm

S-PBGA-B900

XCVP1052-2HSIVFVF1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

BGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY

.854 V

110 Cel

-40 Cel

BOTTOM

CMOS

.88 V

S-PBGA-B1760

XCVP1052-1LLIVSVC2021

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2021

BGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY

.676 V

110 Cel

-40 Cel

BOTTOM

CMOS

.7 V

S-PBGA-B2021

XCVP1802-2MSIVSVA5601

Xilinx

MICROPROCESSOR CIRCUIT

BALL

5601

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA5601,75X75,36

.775 V

110 Cel

-40 Cel

BOTTOM

4.55 mm

70 mm

70 mm

CMOS

.8 V

.92 mm

S-PBGA-B5601

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.