Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU48DR-2FSVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU1EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XC7Z100-1FFG1156C

Xilinx

SYSTEM ON CHIP

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA1156,34X34,40

.95 V

85 Cel

0 Cel

BOTTOM

3.1 mm

35 mm

35 mm

CMOS

1 V

1 mm

S-PBGA-B1156

XCZU11EG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU1EG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU4EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU19EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU1CG-L1UBVA494I

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU27DR-1FSVG1517E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU27DR-L2FFVG1517I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.72 V

R-PBGA-B1517

4

e1

XCZU27DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

240

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU4EG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7CG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7CG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XQ7Z100-2RF900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

BOTTOM

3.44 mm

31 mm

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 mm

S-PBGA-B900

XC7Z030-L2FBG484I

Xilinx

SYSTEM ON CHIP

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

BGA484,22X22,40

.95 V

100 Cel

-40 Cel

BOTTOM

2.54 mm

23 mm

23 mm

CMOS

1 V

1 mm

S-PBGA-B484

XCVC1902-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.854 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.88 V

.92 mm

S-PBGA-B1760

XCVC1902-2LLIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.676 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.7 V

.92 mm

S-PBGA-B2197

e1

XCZU17EG-2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU1EG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU27DR-2FFVE1156I

Xilinx

PROGRAMMABLE SoC

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU2CG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B484

4

e1

XCZU2CG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B625

4

e1

XCZU2EG-1SBVA484E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

CMOS

.85 V

R-PBGA-B484

4

e1

XCZU5EG-1SFVC784E

Xilinx

PROGRAMMABLE SoC

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

BGA784,28X28,32

.825 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU7CG-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7EV-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-L2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XC7Z012S-1CLG485I

Xilinx

SYSTEM ON CHIP

BALL

485

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA485,22X22,32

.95 V

100 Cel

-40 Cel

BOTTOM

1.6 mm

19 mm

19 mm

CMOS

1 V

.8 mm

S-PBGA-B485

XCZU11EG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU11EG-1FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU11EG-2FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU19EG-2FFVE1924I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1924

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1924

4

e1

XCZU1CG-1SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1UBVA494E

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU1EG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU3CG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B484

4

e1

XCZU3CG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B484

4

e1

XCZU4CG-L1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XCZU4EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.