Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1402-2GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1202-1HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2GSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2HLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1402-2DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3LLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1802-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1402-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVP1552-1GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1202-1LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-3DLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-3MLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1MSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XQZU5EV-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XCVC1902-2HLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1902-3GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1202-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1702-3GLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1502-3DLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2DLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2GLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2HSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3HSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B2197
XCVP1702-1HSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XQ7Z100-L2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel		BOTTOM	3.44 mm	31 mm	NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS		1 mm	S-PBGA-B900
XCVC1802-3DSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1702-1DSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	100 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVP1402-2MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1502-2MLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.