Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1802-3HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1702-2DLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1DLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2HSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1GSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3MSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3DLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2HSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-2LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3DLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3GSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1MLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1552-2LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3340
XCVP1402-2HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1802-3HLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1502-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1702-2LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVP1402-3HSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B1760
XCVP1102-1HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2HLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1GSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3DSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1502-2HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1HSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-1GLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2LLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XQZU3EG-2SFRC784I	Xilinx	PROGRAMMABLE SoC	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XCVP1202-3DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2DLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.