Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVP1402-2HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3MLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z020-1CL400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Lead (Sn/Pb)	N	BOTTOM	1.6 mm	17 mm	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400		Not Qualified	e0
XCVP1802-3MLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1202-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.88 V		.92 mm	S-PBGA-B2785
XCVC1502-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVP1202-2MLEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B2197
XCVC1902-3LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1552-3MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3DSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2GSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XQZU7EV-2FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V		1 mm	S-PBGA-B1156	4		e0
XCVP1552-3MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3HSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1HLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2DSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVC1502-2GLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V		.92 mm	S-PBGA-B3340
XCVC1502-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVP1102-1HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1DLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1402-2LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVP1702-2LSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1102-1LLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVC1502-3MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVC1502-1LLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3MSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.