Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1552-3MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1402-2MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVP1402-1GSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1552-2HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1802-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVP1102-3DLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1352-1DLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2HSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3340
XQZU11EG-L1FFRC1156I	Xilinx	PROGRAMMABLE SoC	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVC1902-3LSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XQZU7EV-1FFRC1156M	Xilinx	PROGRAMMABLE SoC	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVP1202-1HLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1802-1MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-2DSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.775 V	110 Cel	0 Cel		BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.8 V	1 mm	S-PBGA-B4072
XCVP1502-2GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1MSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC1702-1MLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XQZU3EG-2SFRA484I	Xilinx	PROGRAMMABLE SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm	40	245	19 mm	CMOS	.85 V	.8 mm	S-PBGA-B484	4	e0
XCVP1202-3GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1552-1HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B3340
XCVC1802-1MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1202-2GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1352-1HSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1HLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVP1802-2MLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.775 V	110 Cel	-40 Cel		BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.8 V	1 mm	S-PBGA-B4072
XCVC1352-1GSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.