Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVP1502-1LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	-40 Cel			BOTTOM	4.4 mm	55 mm			55 mm	CMOS	.7 V		.92 mm	S-PBGA-B3340
XQZU21DR-1FFRD1156M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM			20	220		CMOS	.85 V			S-PBGA-B1156	4		e0
XCVP1402-3LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel			BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVC1802-2MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel			BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V		.92 mm	S-PBGA-B1760
XCVC1802-3DSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3MSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2DSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1402-3HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XQZU29DR-2FFRF1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V			S-PBGA-B1760	4		e0
XCVP1402-2LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU11EG-1FFRB1156I	Xilinx																	Tin/Lead (Sn/Pb)													4		e0
XCVP1202-3GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1502-2HLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1902-2DSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1DSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3MSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1DSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	100 Cel	0 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B2197
XCVP1202-3HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1102-2GLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3DSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2GSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B3340
XCVP1402-1DSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1202-2GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1902-3MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1802-2DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1902-1LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1102-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V		.92 mm	S-PBGA-B2785
XCVP1102-1DLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1GLIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3HLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1MLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.775 V	110 Cel	-40 Cel			BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.8 V		1 mm	S-PBGA-B4072
XCVC1802-3LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XQ7Z020-2CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm	30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XCVC1802-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1402-3LLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel			BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVP1552-2MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1402-1HLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.