Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVC1702-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel			BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVC1702-1LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel			BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XQZU15EG-1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V		1 mm	S-PBGA-B900	4		e0
XCVP1502-3DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3LSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V		.92 mm	S-PBGA-B2785
XCVP1102-2HLIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQZU28DR-1FFRG1517M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V			S-PBGA-B1517	4		e0
XCVP1202-3LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1502-3LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3DLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z045-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B900		Not Qualified	e0
XCVP1402-1DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVC1702-1DLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQZU5EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V		1 mm	S-PBGA-B900	4		e0
XCVP1802-3HLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1MSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2GSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B1760
XCVC1352-2HLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XQZU5EV-2SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e0
XCVP1102-2HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVC1702-2DLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2LLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	0 Cel			BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V		.92 mm	S-PBGA-B3340
XCVC1502-3MSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3DSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V		.92 mm	S-PBGA-B2785
XCVC1502-2DSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2DSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3HLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2LLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT		BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.676 V	110 Cel	0 Cel			BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.7 V		1 mm	S-PBGA-B4072

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.