Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1802-2DSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XQZU7EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XCVP1502-3LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1702-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVC1702-2MLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1HLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1MSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.775 V	100 Cel	0 Cel		BOTTOM	4.56 mm	65 mm			65 mm	CMOS	.8 V	1 mm	S-PBGA-B4072
XCVC1502-3GLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2DSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1702-1HSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1402-1LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3DLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1402-2GLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-2GLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3HLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1702-2HSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQZU5EV-1SFRC784M	Xilinx	PROGRAMMABLE SoC	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XCVC1802-3LSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVC1502-1LSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3DSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1702-2GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2MSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVP1202-1MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVP1202-1DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B1760
XCVC1502-2GLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.