Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1202-2DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1552-3GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2GSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V	.92 mm	S-PBGA-B2197		e1
XCVC1352-2HSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3HSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2LLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1102-2MLIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1902-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVC1802-2GSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1802-3HLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1DSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1352-1HSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3HSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVC1502-2DLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XQ7Z030-L2RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		1 mm	S-PBGA-B484	4	e0
XCVP1552-1MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1802-2DSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVP1102-1LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2DLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2HLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1GLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3HLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1802-1LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.