Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVE2002-2LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B484
XCVP1402-1LSIVSVD2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	-40 Cel			BOTTOM						CMOS	.7 V			R-PBGA-B2197
XCVP1052-1MLINFVI1369	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1369	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			R-PBGA-B1369
XCVC1352-1MLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU29DR-L1FFRF1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V			S-PBGA-B1760	4		e0
XCVP1402-2LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	0 Cel			BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V		.92 mm	S-PBGA-B3340
XCVP1702-3LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3HSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2GLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3HLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z030-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B900		Not Qualified	e0
XCVC1502-2HLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B2197
XCVC1902-2DSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3LSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2DLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1102-2DSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XQZU15EG-1FFRC900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V		1 mm	S-PBGA-B900	4		e0
XCVP1402-1DLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3HLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel			BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760
XCVP1102-2MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2LSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-3DLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1GSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3GLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XQZU48DR-1FSRG1517M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1517		SQUARE	PLASTIC/EPOXY	YES	.876 V	MIL-PRF-38535				.825 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM						CMOS	.85 V			S-PBGA-B1517	4		e0
XCVC1802-1HSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1802-2DLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel			BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVP1102-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVC1502-1DSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XQZU28DR-1FFRE1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V			S-PBGA-B1156	4		e0
XCVP1102-3MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT																TIN SILVER COPPER															e1
XCVP1202-1LSEVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	100 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B2197
XCVP1402-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XQZU29DR-1FFRF1760M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM			40	245		CMOS	.85 V			S-PBGA-B1760	4		e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.