Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVC1802-3DLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XQ7Z030-2RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA484,22X22,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e0
XCVC1502-2HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V		.92 mm	S-PBGA-B2785
XCVP1702-3GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3DSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVC1502-3LLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1552-3DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2GLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.854 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm			45 mm	CMOS	.88 V		.92 mm	S-PBGA-B2197			e1
XCVP1102-2DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQZU15EG-L1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V		1 mm	S-PBGA-B900	4		e0
XCVP1802-1DSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1GLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3DSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3LLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVC1702-3LLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVC1802-1DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1102-3LSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVC1902-1GLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1202-1HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVC1802-2DSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2DLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2DSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1102-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B1760
XCVP1702-2GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.