Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1102-3DSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B1760
XCVC1802-1LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1502-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1202-3MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1502-1DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVP1702-3HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1HLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1502-2GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3DLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2DLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XQZU15EG-1FFRB1156I	Xilinx	PROGRAMMABLE SoC	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVP1702-1DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1902-1MLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1GLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1502-1DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER												e1
XCVC1802-2LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1902-3MLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.854 V	100 Cel	0 Cel		BOTTOM	4.4 mm	55 mm			55 mm	CMOS	.88 V	.92 mm	S-PBGA-B3340
XCVC1902-1HLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2HSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3DSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2GLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1HLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3HSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3GSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3MLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.4 mm	55 mm			55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVP1702-1DLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.