Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XC7Z020-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z010-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z010-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z020-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z020-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
SM-K26-XCL2GI-ED	Xilinx	PSoC
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
SM-K26-XCL2GC-ED	Xilinx	PSoC
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XCZU4EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			30	250		CMOS	.85 V			R-PBGA-B784	4		e1
SM-K26-XCL2GI	Xilinx	PSoC
XC7Z030-1SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	2.44 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z007S-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z020-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z010-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
SM-K26-XCL2GC	Xilinx	PSoC
XC7Z010-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z007S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z020-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400
XC7Z015-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel	0 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z015-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.6 mm	19 mm	30	260	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e1
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z020-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	0 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel	0 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	23 mm			23 mm	CMOS	1 V		1 mm	S-PBGA-B484
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM	1.6 mm	17 mm			17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z015-L1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.6 mm	19 mm			19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
XC7Z035-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z007S-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel			BOTTOM	1.5 mm	13 mm			13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z035-L2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel			BOTTOM	3.35 mm	31 mm			31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.24 mm	27 mm			27 mm	CMOS	1 V		1 mm	S-PBGA-B676

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.