Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
PROGRAMMABLE SoC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
240 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
S-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B1517 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
240 |
CMOS |
.72 V |
R-PBGA-B1517 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
240 |
CMOS |
.72 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA676,26X26,40 |
.95 V |
100 Cel |
-40 Cel |
BOTTOM |
2.54 mm |
27 mm |
27 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B676 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B900 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
900 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA900,30X30,40 |
.95 V |
100 Cel |
-40 Cel |
BOTTOM |
3.24 mm |
27 mm |
27 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B900 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.927 V |
GRID ARRAY |
.873 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.9 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
35 mm |
35 mm |
CMOS |
.9 V |
1 mm |
S-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.51 mm |
40 mm |
30 |
245 |
40 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1760 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1760 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
110 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B900 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY |
BGA484,22X22,40 |
.95 V |
85 Cel |
0 Cel |
BOTTOM |
2.54 mm |
23 mm |
23 mm |
CMOS |
1 V |
1 mm |
S-PBGA-B484 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
240 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
110 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B1517 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
S-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
INDUSTRIAL |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
CMOS |
.85 V |
R-PBGA-B484 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
484 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA484,22X22,32 |
.95 V |
100 Cel |
-40 Cel |
BOTTOM |
1.6 mm |
19 mm |
19 mm |
CMOS |
1 V |
.8 mm |
S-PBGA-B484 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.51 mm |
40 mm |
30 |
245 |
40 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.927 V |
GRID ARRAY |
.873 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.9 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B900 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
485 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA485,22X22,32 |
.95 V |
100 Cel |
0 Cel |
BOTTOM |
1.6 mm |
19 mm |
19 mm |
CMOS |
1 V |
.8 mm |
S-PBGA-B485 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
SYSTEM ON CHIP |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
.95 V |
100 Cel |
0 Cel |
BOTTOM |
1.6 mm |
17 mm |
17 mm |
CMOS |
1 V |
.8 mm |
S-PBGA-B400 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
625 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B625 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
S-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
Tin/Silver/Copper (Sn/Ag/Cu) |
30 |
250 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
PROGRAMMABLE SoC |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
BGA900,30X30,40 |
.698 V |
110 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.88 mm |
31 mm |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
31 mm |
CMOS |
.72 V |
1 mm |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1760 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B1760 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
125 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
N |
BOTTOM |
1.6 mm |
17 mm |
30 |
260 |
17 mm |
CMOS |
Other uPs/uCs/Peripheral ICs |
.8 mm |
S-PBGA-B400 |
3 |
Not Qualified |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
PROGRAMMABLE SoC |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
BGA900,30X30,40 |
.825 V |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
2.88 mm |
31 mm |
30 |
245 |
31 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
110 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
250 |
CMOS |
.72 V |
R-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
784 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY, FINE PITCH |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.32 mm |
23 mm |
30 |
250 |
23 mm |
CMOS |
.85 V |
.8 mm |
S-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
TIN SILVER BISMUTH COPPER NICKEL |
30 |
245 |
4 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.