Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm		30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4		e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XCVC1902-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1502-1GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.88 V		.92 mm	S-PBGA-B2785
XCZU19EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1760	4		e1
XCZU27DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU27DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			S-PBGA-B784	4		e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS	.72 V			R-PBGA-B784	4		e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS	.85 V			R-PBGA-B784	4		e1
XCZU42DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU48DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1517	4		e1
XCZU65DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU6EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XCZU9CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS	.85 V			R-PBGA-B900	4		e1
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm		40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4		e0
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e1
XC7Z010-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm				13 mm	CMOS	1 V		.8 mm	S-PBGA-B225
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel			BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel			BOTTOM	3.35 mm	31 mm				31 mm	CMOS	1 V		1 mm	S-PBGA-B900
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V		1 mm	S-PBGA-B900
XCVC1902-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVC1902-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.7 V			S-PBGA-B784			e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V		.8 mm	S-PBGA-B784			e1
XCVM1102-1MLISFVB625	Xilinx	MICROPROCESSOR CIRCUIT
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							CMOS	.8 V			S-PBGA-B784			e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	40 mm				40 mm	CMOS	.7 V		.92 mm	S-PBGA-B1760			e1
XCVM1802-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1402-2DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.