Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVP1102-2MSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3GLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1702-2DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3LLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3DSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3DLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1552-3HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM						CMOS	.88 V		S-PBGA-B3340
XCVC1352-2GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XQZU15EG-L1FFRB1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVC1702-2HSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3MLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B3340
XCVC1352-3MLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XQZU21DR-1FFRD1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			20	220		CMOS	.85 V		S-PBGA-B1156	4	e0
XCVP1552-1DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3GSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVC1352-2DSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XQZU7EV-1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XCVC1902-2LLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XQ7Z100-1RF1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.53 mm	35 mm	NOT SPECIFIED	NOT SPECIFIED	35 mm	CMOS		1 mm	S-PBGA-B1156		e0
XCVP1802-3DSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1HLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2GLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1802-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVP1502-3DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2HLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1502-3LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1552-3DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3GSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3DLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.