Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVC1702-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVP1202-1HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1202-3HSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1552-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1802-1DLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1102-1MSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1LSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4072	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA4072,64X64,40	.676 V	110 Cel	-40 Cel		BOTTOM	4.56 mm	65 mm	65 mm	CMOS	.7 V	1 mm	S-PBGA-B4072
XCVP1552-2LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2GLIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2LLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm	40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1702-3LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1GSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HLEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197	e1
XCVP1402-3HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.854 V	100 Cel	0 Cel		BOTTOM	4.48 mm	55 mm	55 mm	CMOS	.88 V	.92 mm	S-PBGA-B3340
XCVP1702-1DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-3HLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LLIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP1402-3LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2DLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1502-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1352-2LSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2HLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2LSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1GSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVC1352-2GLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3LLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1102-1MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVP1202-1LLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B2197
XCVP1402-3GSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2HSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVC1802-1GSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.