Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVH1522-1MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B3697
XCVE2102-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVE2002-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625
XCVC2602-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2102-1MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVE2002-2MLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVE2102-2MLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVE2102-2LLESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVE2202-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVH1582-1MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B3697
XCVE2002-2MLESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVE2602-1MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2202-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784	e1
XCVH1582-3HSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B3697
XCVE2002-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.8 V		S-PBGA-B784	e1
XCVE2602-2MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVH1522-2MSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B3697
XCVH1542-1MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVH1582-1LSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B3697
XCVE2102-1LLISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.7 V		S-PBGA-B784	e1
XCVH1542-1LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B4737
XCVE2002-1LLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVE1752-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE2102-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.7 V		S-PBGA-B784	e1
XCVE2302-1LSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY	BGA784,28X28,31	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm	23 mm	CMOS	.7 V	.8 mm	S-PBGA-B784	e1
XCVE1752-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE2002-2LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.7 V		S-PBGA-B784	e1
XCVE2602-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVH1522-1LSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B3697
XCVH1542-2MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVC2602-2LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVH1742-2LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B4737
XCVE2002-1MLISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B484
XCVE2102-2LLESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625
XCVE1752-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE2802-1MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2102-1LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVE1752-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVC2602-3HSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1760
XCVH1582-1LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B4737
XCVE2002-1MSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B625
XCVH1782-2MLELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B4737
XCVE2602-2MLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVH1542-2LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B4737
XCVH1782-2LLELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B4737
XCVC2802-1MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1760
XCVE2102-1LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.