Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVH1582-3HSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B4737
XCVE1752-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm	45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197	e1
XCVC2602-2LLEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVE2002-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B484
XCVC1902-2HSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC2602-2LLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-1MLINSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2802-3HSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1369
XCVC2802-2MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1502-2LLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1902-2LLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XQZU7EV-L1FFRC900I	Xilinx	PROGRAMMABLE RFSoC
XQZU15EG-1FFRB1517I	Xilinx	PROGRAMMABLE RFSoC
XCVC1902-2HSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XQZU15EG-2FFRB1517I	Xilinx	PROGRAMMABLE RFSoC
XCVC1502-1MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1902-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC2802-1LSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1352-1MSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1024
XCVC1702-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVC1702-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC2602-1MLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1902-2MLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1902-2MLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2HSINBVA1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B1024
XCVC1902-2MLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1902-1MLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVC1902-2LLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1MSENSVE1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC2602-2MLENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVC1902-1MSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC1902-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm	35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVC2802-1LLINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1369
XCVC1902-2LSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1MSEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2MSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.