Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1502-1DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER											e1
XCVP1402-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm		50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1702-3LLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2DLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2HSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1902-3LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER											e1
XCVP1552-3LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1HSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER											e1
XCVC1502-3HSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XQZU5EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm	225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XCVC1352-3DLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVH1782-3HSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	100 Cel	0 Cel		BOTTOM					CMOS	.88 V		S-PBGA-B4737
XCVC2602-1MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B1760
XCVC2602-1LSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B1760
XCVE2102-2LSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B484
XCVE2002-1LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B625
XCVE1752-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm		45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVC2802-1MSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B1760
XCVC2602-2MSEVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	0 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B1760
XCVH1782-2LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B4737
XCVE2102-2MSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B484
XCVE2102-1LSISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B625
XCVE2302-1MSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm		23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVE1752-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE2602-1LSIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B1760
XCVH1542-2LLELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B4737
XCVH1782-1MSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B4737
XCVE1752-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE2102-1MSESBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B484
XCVE2802-2MLIVFVH1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B1760
XCVE2002-1MSESBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM					CMOS	.8 V		S-PBGA-B625
XCVH1542-1LSEVSVA3697	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3697	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B3697
XCVH1782-1LSELSVA4737	Xilinx	MICROPROCESSOR CIRCUIT	BALL	4737	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel		BOTTOM					CMOS	.7 V		S-PBGA-B4737

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.