Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCVC1702-2MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1596

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1596,40X40,36

.775 V

110 Cel

-40 Cel

BOTTOM

4 mm

37.5 mm

37.5 mm

CMOS

.8 V

.92 mm

S-PBGA-B1596

XCVC1902-2MSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1596

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1596,40X40,36

.775 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1596

XCVC1352-2DSIVSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1552-2DLIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1802-1GSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1802-2LLIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.676 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.7 V

.92 mm

S-PBGA-B2197

e1

XCVC1902-1DLEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVC1502-2DLIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1402-2DSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1402-3DSIVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1202-3DSIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1902-1LSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.676 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.7 V

.92 mm

S-PBGA-B1760

XCVP1802-2LSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1502-1MSIVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1596

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1596,40X40,36

.775 V

110 Cel

-40 Cel

BOTTOM

4 mm

37.5 mm

37.5 mm

CMOS

.8 V

.92 mm

S-PBGA-B1596

XCVP1402-3DLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1402-2LLIVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1802-2HLEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVP1102-3LSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1502-2DSIVBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1702-1MSEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1596

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1596,40X40,36

.775 V

100 Cel

0 Cel

BOTTOM

4 mm

37.5 mm

37.5 mm

CMOS

.8 V

.92 mm

S-PBGA-B1596

XCVP1802-1HSILSVC4072

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1902-2GSIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVP1552-1MLIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

.775 V

110 Cel

-40 Cel

BOTTOM

CMOS

.8 V

S-PBGA-B3340

XCVP1502-1MLIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

BALL

3340

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA3340,58X58,36

.775 V

110 Cel

-40 Cel

BOTTOM

4.4 mm

55 mm

55 mm

CMOS

.8 V

.92 mm

S-PBGA-B3340

XCVC1502-1GLEVSVA1596

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1802-3DLELSVC4072

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1502-2GSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1202-3GSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1102-1DLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1102-3GLEVFVA1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1502-1GLEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1402-3LLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1702-2DSILSVC4072

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1502-1GLIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1352-2DSEVSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1402-3LSEVFVC1760

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1702-3MLEVSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1502-3DSIVBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1502-1HLEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVC1502-2GLEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVC1902-1DLEVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1352-3MSEVBVA1024

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1202-3HLEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

XCVC1702-2GLIVSVE1369

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1902-3MSIVIVA1596

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1702-3DSIVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1502-2DLEVSVG1369

Xilinx

MICROPROCESSOR CIRCUIT

XCVC1802-1HSIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.