Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	JESD-609 Code
XCVP1802-2LLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVE1752-2HSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm	37.5 mm	CMOS	.88 V	.92 mm	S-PBGA-B1596
XCVP1002-2LLEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B1760
XCVP1802-1LLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.7 V	.92 mm	S-PBGA-B5601
XCVP2502-2MLIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1002-1MSIVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B2021
XCVP1702-2MSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		R-PBGA-B5601
XCVP1802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVE2802-1MSENSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	100 Cel	0 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVP1052-2MLIVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B2021
XCVP2502-2LSEVSVB3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	0 Cel		BOTTOM				CMOS	.7 V		R-PBGA-B3340
XCVP1702-1LSIVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		R-PBGA-B5601
XCVP2802-1MSEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT	BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	100 Cel	0 Cel		BOTTOM	4.55 mm	70 mm	70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCVP1002-1LLIVSVC2021	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2021	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B2021
XCVE2602-2MSINSVH1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM				CMOS	.8 V		S-PBGA-B1369
XCVE2102-2HSISBVA484	Xilinx	MICROPROCESSOR CIRCUIT	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	.906 V	GRID ARRAY		.854 V	110 Cel	-40 Cel		BOTTOM				CMOS	.88 V		S-PBGA-B484
XCVE2002-2LLISBVA625	Xilinx	MICROPROCESSOR CIRCUIT	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM				CMOS	.7 V		S-PBGA-B625
XQZU48DR-2FSRG1517I	Xilinx	PROGRAMMABLE RFSoC	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA1517,39X39,40	.808 V	100 Cel	-40 Cel		BOTTOM	4.01 mm	40 mm	40 mm	CMOS	.85 V	1 mm	S-PBGA-B1517
XCVC1502-3LSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1DLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1DSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-3LSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-1DLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT													TIN SILVER COPPER									e1
XCVP1102-3MSIVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3DSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm	50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1702-2MLIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1GLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3DLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1LLELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3LLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT	BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm	55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVP1502-3HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1MLEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1DLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3MSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1DLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1GLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1LLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-2DLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.