Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1902-2DLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1702-3HSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3HLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1DSIVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVP1702-3MLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2GSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1902-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVP1552-3MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2HSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3LSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-2MSEVSVE1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1102-3HSEVFVA1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVP1552-2DSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2MLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.8 V	.92 mm	S-PBGA-B1760
XCVP1102-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVC1802-3GSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
DO-DI-PCI32-SP	Xilinx
XCVC1802-2LLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVP1402-2DSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3HLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2MSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1GLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-2LSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760
XCVP1502-1LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVC1902-2HLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER												e1
XCVC1502-3GLEVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1HLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1LSIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	110 Cel	-40 Cel		BOTTOM						CMOS	.7 V		S-PBGA-B2197
XCVP1102-3HSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQZU28DR-1FFRG1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535	GRID ARRAY		.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM			40	245		CMOS	.85 V		S-PBGA-B1517	4	e0
XCVC1502-3GLIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3DLIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-1GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.