Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVC1502-3GLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1DSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2HLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1702-1HLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1552-2GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1DLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-2DLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2LSIVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2DLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3GLIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2DLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XQ7Z020-L1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, LOW PROFILE, FINE PITCH			100 Cel	-40 Cel	TIN LEAD	BOTTOM	1.6 mm	19 mm	30	225	19 mm	CMOS		.8 mm	S-PBGA-B484	3	e0
XCVP1402-3MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-1GLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1102-3HSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3MSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-1DSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3GSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GSIVSVG1369	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2DLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2GLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-1LSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.676 V	100 Cel	0 Cel		BOTTOM	4.48 mm	55 mm			55 mm	CMOS	.7 V	.92 mm	S-PBGA-B3340
XCVP1202-2MLIVSVC2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel		BOTTOM						CMOS	.8 V		S-PBGA-B2197
XCVP1202-2DSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1502-3LSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3DSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2MSEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3GLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-3GSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1LLEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3GSEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1GLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1DSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-1LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	40 mm			40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVC1802-1HLEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-1LSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V	.92 mm	S-PBGA-B2785
XCVP1402-3LSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3LSEVIVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-3LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT														TIN SILVER COPPER												e1
XCVC1352-3MSIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-3GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.