Xilinx Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVP1402-3GSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-3DLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2LLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3LLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3MSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2MLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1202-3DSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1402-3MLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1702-2GLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XQZU3EG-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4		e0
XCVP1552-3GLEVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-3GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1GLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3GSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-2HLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2HLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1902-3MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel			BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V		.92 mm	S-PBGA-B1596
XCVC1802-3GLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1702-1HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-1GSIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3HLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1802-2GLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVC1502-3GLIVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1502-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	4 mm	45 mm	NOT SPECIFIED	NOT SPECIFIED	45 mm	CMOS	.7 V		.92 mm	S-PBGA-B2197			e1
XCVC1702-2GSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1552-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.88 V		.92 mm	S-PBGA-B2785
XCVP1402-1LLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.676 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.7 V		.92 mm	S-PBGA-B2785
XCVP1102-2MSIVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel			BOTTOM						CMOS	.8 V			S-PBGA-B1760
XQ7Z030-1RB484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA484,22X22,40		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.35 mm	23 mm	30	225	23 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B484	4	Not Qualified	e0
XCVP1502-1MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-3GLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1202-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER COPPER															e1
XCVP1202-1GLIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z030-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA900,30X30,40				TIN LEAD	N	BOTTOM	3.44 mm	31 mm			31 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B900		Not Qualified	e0
XCVP1702-3GSILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1102-2HLEVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1352-1GSEVBVA1024	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-1MSIVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	-40 Cel			BOTTOM	4.48 mm	50 mm			50 mm	CMOS	.8 V		.92 mm	S-PBGA-B2785
XCVP1102-1MLIVFVC1760	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1802-2HSELSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-1LSEVFVF1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel			BOTTOM						CMOS	.7 V			S-PBGA-B1760
XCVC1702-2DLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1402-3GLIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT
XCVC1702-1DSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT
XQ7Z045-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm	30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676	4	Not Qualified	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.