Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFE5U-12F-6BG381I	Lattice Semiconductor	FPGA		Ball	381	FBGA	Square	Plastic/Epoxy		Yes	1.155 V	1500		197		1.1			Grid Array, Fine Pitch	BGA381,20X20,32		1.045 V	.8 mm	100 °C (212 °F)		1500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B381	3	1.76 mm	17 mm						197	260 °C (500 °F)	17 mm
LFMXO5-25-8BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm						252		17 mm
LFXP2-8E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
M2GL005S-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			209		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					209		23 mm
M2GL005S-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			209		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	209	250 °C (482 °F)	23 mm
M2S005S-VFG256	Microchip Technology	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6060	Yes	1.26 V			161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.56 mm	14 mm					40 s	161	250 °C (482 °F)	14 mm
M2S010-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V			233		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	233	250 °C (482 °F)	23 mm
M2S050T-1FGG896	Microchip Technology	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			377		1.2			Grid Array	BGA896,30X30,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.44 mm	31 mm					40 s	377	250 °C (482 °F)	31 mm
M2S090TS-1FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
T20F256C3	Efinix	FPGA		Ball	256	TFBGA	Square	Plastic/Epoxy	19728	Yes	1.25 V		SMIC	195		1.2			Grid Array, Thin Profile, Fine Pitch	BGA256,16X16,32		1.15 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.2 mm	13 mm						195	260 °C (500 °F)	13 mm
XC3S1400AN-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S1600E-4FGG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC7A15T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-L2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300		250		0.9			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7K325T-1FBG900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.74 ns	25475 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XCZU9EG-2FFVB1156I4522	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.892 V	34260				0.85			Grid Array			.808 V	1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1156		3.42 mm	35 mm								3.42 mm
10AX066N2F40E2SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	588		0.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				588		40 mm
10CX105YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780									284
10M16DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			320		23 mm
10M50DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
5AGXBB1D4F40I5N	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11321 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	622 MHz		704		40 mm
EP1C4F400C8N	Intel	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	4000	Yes	1.575 V	400		301		1.5		1.5,1.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.2 mm	21 mm	No		e1	275 MHz		301		21 mm
EP1SGX40GF1020C6N	Intel	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V	4697	CMOS	624		1.5		1.5,1.5/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		4697 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1			624		33 mm
EP3C25F324C6	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP3C55F484C6N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE75F23I7	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		295		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			4713 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0			295		23 mm
ICE40LP4K-CM81TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm			e1		30 s	63	260 °C (500 °F)	4 mm
ICE40LP8K-CM121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm			e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO3L-1300E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		206		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LFE2-20E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2M20SE-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375		140		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-17EA-6LMG328I	Lattice Semiconductor	FPGA		Ball	328	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			116		1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA328,19X19,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B328	3	1.5 mm	10 mm	No		e1	375 MHz	30 s	116	260 °C (500 °F)	10 mm
LFMXO5-25-7BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
LFMXO5-25-7BBG400C	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm						252		17 mm
LFMXO5-25-8BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm						160		14 mm
LFXP2-8E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
M1A3P600-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	13824	CMOS		600000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M2GL005-VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm					Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm			e0					17 mm
M2GL090-1FG484IX417	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm					Tin Lead	Bottom	S-PBGA-B484		2.44 mm	23 mm			e0					23 mm
MPF300TLS-FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
XC3S200A-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	248	200000	1.2		1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC5VFX30T-1FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS	360		1		1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC6SLX45-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	316	225 °C (437 °F)	23 mm
XC7A200T-1SBG484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.44 mm	19 mm	No		e1	1098 MHz	30 s	285	250 °C (482 °F)	19 mm
XC7A200T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	CMOS	285		1		1 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A200T-L1FBG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		285		.95			Grid Array			.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm			e1		30 s	285	250 °C (482 °F)	23 mm
XC7K410T-L2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy		Yes	.97 V	31775				.95			Grid Array			.93 V	1 mm		0.61 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1		30 s		250 °C (482 °F)	27 mm
XC7S100-1FGGA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.