Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL016ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				340		23 mm
10CL080YF780C6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10CX105YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10CX220YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284		.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780									284
10M08SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				250		15 mm
10M16SCU169A7P	Intel	FPGA	Automotive	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M25DAF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DCF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
10M40DCF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
5AGZME3E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342		0.85			Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)		13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	33 mm						342		33 mm
5CEBA2F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
EP3C25F324C8	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP4CE75F23I8LN	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713		295		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			4713 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		295		23 mm
ICE40LP8K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No		e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO2-256ZE-3UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO3LF-9400C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE3-70EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-7FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-8FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-40E-5FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS	363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
M2GL025T-1VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm	No				20 s	207	240 °C (464 °F)	17 mm
M2GL090TS-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V		100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325				No				20 s	180	240 °C (464 °F)
M2S050-FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
M2S090TS-FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	86184	Yes	1.26 V			425		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	425	250 °C (482 °F)	27 mm
M7A3PE1500-FG484I	Microsemi	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	38400	Yes	1.575 V		CMOS	280	1500000	1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			280		23 mm
MPF500T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TFCG1152E	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
U1AFS600-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	119	600000	1.5	Tray	1.5,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.68 mm	17 mm	No		e1	350 MHz	30 s	119	250 °C (482 °F)	17 mm
XC3S1600E-4FGG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e1	572 MHz	30 s	232	250 °C (482 °F)	21 mm
XC7V2000T-1FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200		1		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No		e1	1818 MHz		1200		45 mm
XC7V2000T-2FLG1925C	Xilinx	FPGA	Other	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No		e1	1818 MHz		1200		45 mm
XCKU035-1FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
10AX022E4F29I3SG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	TSMC	288		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		8033 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10M08DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			250		17 mm
10M08DFV81C7G	Intel	FPGA	Commercial Extended	Ball	81	VFBGA	Rectangular	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.15 V	.4 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B81	1	.54 mm	4.377 mm	No					250		4.496 mm
10M16SCU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M50DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						500		23 mm
10M50DAF672I7G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5CEBA2F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
A2F500M3G-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS	128	500000	1.5	Tray	1.5,1.8,2.5,3.3 V	Grid Array	BGA484,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		11520 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	80 MHz	30 s	128	250 °C (482 °F)	23 mm
EP2C50F484I8N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	294		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm			3158 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	278	245 °C (473 °F)	23 mm
EP2S15F672C3N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	15600	Yes	1.25 V	6240	CMOS	366		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	4.45 ns	6240 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	717 MHz		358		35 mm
EP4CE30F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	28848	Yes	1.25 V	1803		535		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1803 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		535		29 mm
LCMXO3L-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LCMXO3LF-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFE2M20E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375		140		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-70EA-6FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFE3-70EA-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.