Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFE3-70EA-8FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-5E-5FT256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V		CMOS	172		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	435 MHz	30 s	172	225 °C (437 °F)	17 mm
LIFCL-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
M2GL025-FCSG325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS	180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325	3		11 mm	No					180		11 mm
M2GL060TS-1FGG676I	Microchip Technology	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s		250 °C (482 °F)	27 mm
M2GL060TS-1VF400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm					20 s		240 °C (464 °F)	17 mm
M2S060-FGG676	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			387		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	387	250 °C (482 °F)	27 mm
M2S060T-1FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			387		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	387	250 °C (482 °F)	27 mm
M2S060TS-1FGG676I	Microchip Technology	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			387		1.2			Grid Array	BGA676,26X26,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm					40 s	387	250 °C (482 °F)	27 mm
XC6SLX16-3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	160		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1	862 MHz	30 s	160	260 °C (500 °F)	13 mm
XC6SLX75-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	280		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	280	250 °C (482 °F)	23 mm
XC7A15T-2FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1300				1			Grid Array			.95 V	1 mm		1.05 ns	1300 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC7A200T-L2FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825	CMOS	285		.9		0.9 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	Also Operates at 1 V supply	e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7A35T-L1FGG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	.98 V	2600				.95			Grid Array			.92 V	1 mm		1.27 ns	2600 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1					23 mm
XC7K410T-1FBG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K70T-L2FBG484E	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	.93 V	5125	CMOS	285		.9		0.9,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No	Also Operates at 1 V supply	e1		30 s	285	250 °C (482 °F)	23 mm
XCKU040-2FBVA900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920		520		.95		0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
XCVU3P-1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
10AX027E4F29E3SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	360		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10CX105YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780									284
10CX105YU484E5G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	188		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484									188
10M25DAF256I7P	Intel	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2			Grid Array, Low Profile	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm						360		17 mm
5CEBA5F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V	2908	CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		2908 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
A3P1000-FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
A3P250-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm
A3P400-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	17 mm
EP1S20F484I6	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V		CMOS	586		1.5		1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm						Bottom	S-PBGA-B484				No					586
EP1S20F484I6N	Intel	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	18460	Yes	1.575 V		CMOS	586		1.5		1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1			586
LCMXO2-1200ZE-1UWG25ITR50	Lattice Semiconductor	FPGA		Ball	25	BGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160		18		1.2	Tape and Reel	1.2 V	Grid Array	BGA25,5X5,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B25	1	.615 mm	2.492 mm	No		e1	133 MHz	30 s	18	260 °C (500 °F)	2.546 mm
LFE3-70EA-6LFN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-30E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29000	Yes	1.26 V	3625	CMOS	363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
M2GL050T-1FG484M	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56340	Yes	1.26 V			267		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
MPF500T-1FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
XC3S1400AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	408	225 °C (437 °F)	27 mm
XC6SLX75T-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	268		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	268	250 °C (482 °F)	23 mm
XC6SLX9-2CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	100		1.2		1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
XC7K355T-1FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	356160	Yes	1.03 V	27825	CMOS	300		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	27825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	300	245 °C (473 °F)	31 mm
XCVU29P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000		676		0.9			Grid Array	BGA2577,51X51,40		.873 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						676		52.5 mm
XCVU3P-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
10M16DAF484A7G	Intel	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			320		23 mm
5CEBA2U15C7N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	176		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA5F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					240		23 mm
A3P1000-FG484	Microchip Technology	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz	20 s		225 °C (437 °F)	23 mm
A3P250-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
APA300-FG256	Microchip Technology	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	8192	Yes	2.7 V		CMOS	186	300000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.3 V	1 mm	70 °C (158 °F)		300000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			180 MHz		186		17 mm
APA300-FG256A	Microchip Technology	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	8192	Yes			CMOS	186			Tray	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B256				No					186
EP3C55U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		327		19 mm
EP3C80U484C8N	Intel	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	295		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		295		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.