Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M7A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
MPF300TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TS-FC784M	Microchip Technology	FPGA	Military	Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
XC3S1200E-4FGG320CS1	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	250	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC6SLX150T-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	862 MHz	30 s	396	225 °C (437 °F)	27 mm
XC6SLX150T-3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	540		1.2		1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	862 MHz	30 s	540	250 °C (482 °F)	31 mm
XC7A15T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7S75-2FGGA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	6000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1286 MHz		400		27 mm
XCAU20P-1FFVB676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		13625 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	228	250 °C (482 °F)	27 mm
10M08DCU324A7G	Intel	FPGA	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M16DAF484I7P	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm						320		23 mm
10M16DCF256A7G	Intel	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	125 °C (257 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			320		17 mm
5AGXMB1G4F31C4N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11321 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1			704		31 mm
5CEFA4U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	48000	Yes	1.13 V		CMOS	304		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					304		19 mm
5CGTFD7C5U19I7N	Intel	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm	No					240		19 mm
A3PE600-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS	270	600000	1.5	Tray	1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0	350 MHz		270		23 mm
EP2C20F484C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	315		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	450 MHz		299		23 mm
EP3C16U484C8N	Intel	FPGA	Other	Ball	484	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	346		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		346		19 mm
EP3C55F484I7	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
LCMXO3L-2100E-5UWG49CTR1K	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LCMXO3L-4300E-5UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm
LFD2NX-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-70SE-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
LFMXO5-25-8BBG400I	Lattice Semiconductor	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	252		1			Grid Array, Low Profile, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm						252		17 mm
M1AGL600V2-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
MPF050T-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS	176		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				176		19 mm
MPF100TS-FCG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.87 mm	23 mm		It also Operates at 1.05 V nominal supply				244		23 mm
MPF500T-1FCG784I	Microchip Technology	FPGA		Ball	784	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
XC2V250-6CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	92	250000	1.5		1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.35 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	820 MHz	30 s	92	240 °C (464 °F)	12 mm
XC3S2000-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS	333	2000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S400-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	264	400000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	264	250 °C (482 °F)	23 mm
XC3S500E-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	232	500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	572 MHz	30 s	176	225 °C (437 °F)	19 mm
XC6SLX9-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	200		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	200	260 °C (500 °F)	15 mm
XC6VLX195T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A100T-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
10AX016E4F29E3SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	288		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					288		29 mm
10CL080ZF780I8G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423		1			Grid Array	BGA780,28X28,40		.97 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm		-40 to 125 °C range is available as extended industrial				423		29 mm
10M16SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M50DAF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
AGL600V5-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
EP3C55F484C7N	Intel	FPGA	Other	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4SGX530KH40I4G	Intel	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248				0.9			Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)		21248 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.4 mm	42.5 mm								42.5 mm
ICE40LP8K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm			e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO2-1200HC-6MG132I	Lattice Semiconductor	FPGA		Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			104		2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO3L-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1			63	260 °C (500 °F)	3.797 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.