FPGA SOC Field Programmable Gate Arrays (FPGA) 74

Reset All

Part	Manufacturer	Programmable IC Type	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7Z010-1CLG225E	Xilinx	FPGA SOC	Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1	30 s	140	260 °C (500 °F)	13 mm
XC7Z020-L2CLG484I	Xilinx	FPGA SOC	Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	330	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm		e1	30 s	330	260 °C (500 °F)	19 mm
XCZU9EG-1LFFVC900I	Xilinx	FPGA SOC	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XC7Z010-L2CLG400I	Xilinx	FPGA SOC	Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z020-2CLG484C	Xilinx	FPGA SOC	Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	330	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm		e1	30 s	330	260 °C (500 °F)	19 mm
XC7Z010-2CLG225C	Xilinx	FPGA SOC	Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1		140		13 mm
XC7Z035-L1FBG676I	Xilinx	FPGA SOC	Ball	676	BGA	Square	Plastic/Epoxy	275000	Yes	1.05 V	21487	380	4100000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	21487 CLBS, 4100000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	2.54 mm	27 mm		e1	30 s	380	250 °C (482 °F)	27 mm
XQZU11EG-L1FFRC1760I	Xilinx	FPGA SOC	Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XC7Z100-3FFG1156E	Xilinx	FPGA SOC	Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675	530	6600000	1	Grid Array	BGA1156,34X34,40	.95 V	1 mm	100 °C (212 °F)	0.94 ns	34675 CLBS, 6600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	PL block operates in 0.97V to 1.03V supply			530		35 mm
XCZU9EG-2LFFVC900E	Xilinx	FPGA SOC	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	110 °C (230 °F)		34260 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XC7Z035-L1FFG900I	Xilinx	FPGA SOC	Ball	900	BGA	Square	Plastic/Epoxy	275000	Yes	1.05 V	21487	492	4100000	1	Grid Array	BGA900,30X30,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	21487 CLBS, 4100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm		e1		492		31 mm
XC7Z010-2CLG400C	Xilinx	FPGA SOC	Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z020-L2CLG400I	Xilinx	FPGA SOC	Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	255	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	255	260 °C (500 °F)	17 mm
XC7Z100-L1FFG1156I	Xilinx	FPGA SOC	Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675	530	6600000	1	Grid Array	BGA1156,34X34,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	34675 CLBS, 6600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm	PL block operates in 0.97V to 1.03V supply			530		35 mm
XQZU9EG-1FFRC900I	Xilinx	FPGA SOC	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm		e0	40 s		245 °C (473 °F)	31 mm
XQZU9EG-2FFRB1156I	Xilinx	FPGA SOC	Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm		e0	40 s		245 °C (473 °F)	35 mm
XC7Z030-L1SBG485I	Xilinx	FPGA SOC	Ball	485	FBGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825	280	1900000	1	Grid Array, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B485	4	2.44 mm	19 mm		e1	30 s	280	250 °C (482 °F)	19 mm
XQZU9EG-2FFRC900I	Xilinx	FPGA SOC	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm		e0	40 s		245 °C (473 °F)	31 mm
XCZU9EG-1FFVB1156I4524	Xilinx	FPGA SOC	Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.892 V	34260	328		0.85	Grid Array	BGA1156,34X34,40	.808 V	1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1	30 s	328	245 °C (473 °F)	35 mm
XCZU9EG-2LFFVB1156E	Xilinx	FPGA SOC	Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	110 °C (230 °F)		34260 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XCZU27DR-2LFSVG1517E	Xilinx	FPGA SOC																					Tin/Silver/Copper			4				e1	20 s		260 °C (500 °F)
XC7Z030-L1FFG676I	Xilinx	FPGA SOC	Ball	676	BGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825	380	1900000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.24 mm	27 mm		e1	30 s	380	250 °C (482 °F)	27 mm
XCZU27DR-1LFFVG1517I	Xilinx	FPGA SOC																					Tin Silver Copper			4				e1	30 s		245 °C (473 °F)
XCZU27DR-2LFFVE1156E	Xilinx	FPGA SOC																					Tin/Silver/Copper			4				e1	30 s		245 °C (473 °F)
XCZU46DR-2LFSVH1760I	Xilinx	FPGA SOC
XCZU46DR-2LFFVH1760I	Xilinx	FPGA SOC

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.