FPGA SOC Field Programmable Gate Arrays (FPGA) 74

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCZU9EG-2FFVB1156I4522	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.892 V	34260			0.85	Grid Array		.808 V	1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1156		3.42 mm	35 mm						3.42 mm
XQZU11EG-1FFRC1760M	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XQZU9EG-1FFRB1156M	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm		e0	40 s		245 °C (473 °F)	35 mm
XQZU19EG-1FFRC1760M	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XCZU27DR-2LFFVG1517E	Xilinx	FPGA SOC																						Tin Silver Copper			4				e1	30 s		245 °C (473 °F)
XQZU9EG-1FFRC900M	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm		e0	40 s		245 °C (473 °F)	31 mm
XCZU9EG-2LFFVB1156E	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	110 °C (230 °F)		34260 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XCZU27DR-2LFSVG1517E	Xilinx	FPGA SOC																						Tin/Silver/Copper			4				e1	20 s		260 °C (500 °F)
XC7Z030-L1FFG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825	380	1900000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.24 mm	27 mm		e1	30 s	380	250 °C (482 °F)	27 mm
XCZU27DR-1LFFVG1517I	Xilinx	FPGA SOC																						Tin Silver Copper			4				e1	30 s		245 °C (473 °F)
XCZU27DR-2LFFVE1156E	Xilinx	FPGA SOC																						Tin/Silver/Copper			4				e1	30 s		245 °C (473 °F)
XC7Z100-L1FFG1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675	530	6600000	1	Grid Array	BGA1156,34X34,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	34675 CLBS, 6600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm	PL block operates in 0.97V to 1.03V supply			530		35 mm
XC7Z035-L1FBG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	275000	Yes	1.05 V	21487	380	4100000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	21487 CLBS, 4100000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	2.54 mm	27 mm		e1	30 s	380	250 °C (482 °F)	27 mm
XQZU11EG-L1FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XC7Z100-3FFG1156E	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675	530	6600000	1	Grid Array	BGA1156,34X34,40	.95 V	1 mm	100 °C (212 °F)	0.94 ns	34675 CLBS, 6600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	PL block operates in 0.97V to 1.03V supply			530		35 mm
XCZU9EG-2LFFVC900E	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	110 °C (230 °F)		34260 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XQZU9EG-1FFRC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B900	4	3.62 mm	31 mm		e0	40 s		245 °C (473 °F)	31 mm
XQZU9EG-2FFRB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm		e0	40 s		245 °C (473 °F)	35 mm
XCZU9EG-1LFFVC900I	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XC7Z010-L2CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z020-2CLG484C	Xilinx	FPGA SOC		Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	330	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm		e1	30 s	330	260 °C (500 °F)	19 mm
XC7Z010-2CLG225C	Xilinx	FPGA SOC		Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1		140		13 mm
XQZU11EG-1FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XC7Z020-1CLG484E	Xilinx	FPGA SOC		Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	330	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm		e1	30 s	330	260 °C (500 °F)	19 mm
XC7Z010-2CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z020-L2CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	255	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	255	260 °C (500 °F)	17 mm
XC7Z010-3CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)	0.94 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z010-3CLG400I	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	230	260 °C (500 °F)	17 mm
XC7Z010-1CLG225E	Xilinx	FPGA SOC		Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1	30 s	140	260 °C (500 °F)	13 mm
XC7Z020-L2CLG484I	Xilinx	FPGA SOC		Ball	484	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	330	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	6650 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.6 mm	19 mm		e1	30 s	330	260 °C (500 °F)	19 mm
XQZU19EG-2FFRC1760I	Xilinx	FPGA SOC		Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340	512		0.85	Grid Array	BGA1760,42.5X42.5,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		e0	40 s	512	245 °C (473 °F)	42.5 mm
XCZU27DR-2FSVE1156I5070	Xilinx	FPGA SOC	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	930300	Yes	.876 V	53160	394		0.85	Grid Array	BGA1156,34X34,40	.825 V	1 mm	100 °C (212 °F)		53160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.86 mm	35 mm		e1	30 s	366	240 °C (464 °F)	35 mm
XCZU9EG-1LFFVB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.85	Grid Array			1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1	30 s		245 °C (473 °F)	3.42 mm
XQZU9EG-1FFRB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260			0.85	Grid Array		.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm		e0	40 s		245 °C (473 °F)	35 mm
XCZU27DR-2LFSVE1156E	Xilinx	FPGA SOC																						Tin/Silver/Copper			4				e1	30 s		240 °C (464 °F)
XC7Z015-L2CLG485I	Xilinx	FPGA SOC		Ball	485	LFBGA	Square	Plastic/Epoxy	74000	Yes	1.05 V	5775	280	1100000	1	Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32	.95 V	.8 mm	100 °C (212 °F)		5775 CLBS, 1100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B485	3	1.6 mm	19 mm		e1		280		19 mm
XC7Z030-L1FBG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	125000	Yes	1.05 V	9825	380	1900000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)	1.27 ns	9825 CLBS, 1300000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	2.54 mm	27 mm		e1	30 s	380	250 °C (482 °F)	27 mm
XQZU19EG-L1FFRB1517I	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			0.85	Grid Array	BGA1517,40X40,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm		e0	40 s		245 °C (473 °F)	40 mm
XQZU19EG-1FFRB1517M	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			0.85	Grid Array	BGA1517,40X40,40	.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm		e0	40 s		245 °C (473 °F)	40 mm
XC7Z100-3FFG900E	Xilinx	FPGA SOC		Ball	900	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675	492	6600000	1	Grid Array	BGA900,30X30,40	.95 V	1 mm	100 °C (212 °F)	0.94 ns	34675 CLBS, 6600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	PL block operates in 0.97V to 1.03V supply	e1		492		31 mm
XCZU9EG-3FFVB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260			0.9	Grid Array			1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1				3.42 mm
XC7Z010-L2CLG225I	Xilinx	FPGA SOC		Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	2200 CLBS, 430000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1		140		13 mm
XC7Z020-3CLG400C	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	85000	Yes	1.05 V	6650	255	1300000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	85 °C (185 °F)	0.94 ns	6650 CLBS, 1300000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1	30 s	255	260 °C (500 °F)	17 mm
XC7Z010-3CLG225C	Xilinx	FPGA SOC		Ball	225	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	140	430000	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	0.94 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.5 mm	13 mm		e1		140		13 mm
XQZU19EG-2FFRB1517I	Xilinx	FPGA SOC		Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			0.85	Grid Array	BGA1517,40X40,40	.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1517	4	3.71 mm	40 mm		e0	40 s		245 °C (473 °F)	40 mm
XC7Z010-1CLG400E	Xilinx	FPGA SOC		Ball	400	LFBGA	Square	Plastic/Epoxy	28000	Yes	1.05 V	2200	230	430000	1	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2200 CLBS, 430000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.6 mm	17 mm		e1		230		17 mm
XC7Z045-L1FBG676I	Xilinx	FPGA SOC		Ball	676	BGA	Square	Plastic/Epoxy	350000	Yes	1.05 V	27325	380	5200000	1	Grid Array	BGA676,26X26,40	.95 V	1 mm	100 °C (212 °F)		27325 CLBS, 5200000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm		e1		380		27 mm
XCZU27DR-1LFFVE1156I	Xilinx	FPGA SOC																						Tin/Silver/Copper			4				e1	30 s		245 °C (473 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.