256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7128AEFI256-6

Altera

EE PLD

Industrial

Ball

256

TBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.1 mm

17 mm

No

e0

166.7 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM1270GF256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

980

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM1270GF256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPM2210GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

204

EPF10K50EBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM1270GM256C4

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPF6016AFI256-1

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 171 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172 MHz

171

220 °C (428 °F)

17 mm

171

EPF10K50SFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPM7512BBI256-5N

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

512

CMOS

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

1.27 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

Yes

EPF10K50SFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM1270GM256I4

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPF6024AFC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

20 s

219

220 °C (428 °F)

17 mm

219

EPM7512BBI256-7

Altera

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.7 mm

27 mm

No

e0

119 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF6016BI256-3

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

5.5 V

CMOS

204

5

3.3/5,5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

133 MHz

204

220 °C (428 °F)

27 mm

218

EPF10K30EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 176 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPM570M256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM7384AEFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

384

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF6016AFC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

171

220 °C (428 °F)

17 mm

171

EPM7512AEBI256-10N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells

e1

163.9 MHz

27 mm

212

EPM7512AEBC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

163.9 MHz

20 s

220 °C (428 °F)

27 mm

Yes

212

EPM7128ABI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

166.7 MHz

27 mm

100

EPF10K100EFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM7512AEFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

116.3 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

EPM7256AEFI256-6

Altera

EE PLD

Industrial

Ball

256

TBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Thin Profile

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.1 mm

17 mm

No

e1

166.7 MHz

17 mm

164

EPF10K100BBC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

Grid Array

Mixed

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K100EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM7064AEFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 68 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

100 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM7128BFI256-4

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 100 I/O

0

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

238.1 MHz

220 °C (428 °F)

17 mm

Yes

100

EPF10K50SFI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPF10K30ABI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2 ns

1728

Yes

3.6 V

CMOS

246

3.3

3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

246

220 °C (428 °F)

27 mm

191

EPM2210F256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 204 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

204

EPM7512AEBI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells

e0

71.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EPM7512AEBI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells

e1

163.9 MHz

27 mm

212

EPM7064BFC256

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

68

EPM3128AFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 98 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

98

EPF10K50EBC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP1K100FI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

16 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

333

220 °C (428 °F)

17 mm

186

EPF10K30EFI256-3X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

176

EPM7128ALBC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPM570M256C5N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPM7128BFI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3.5 mm

17 mm

No

e1

243.9 MHz

17 mm

Yes

100

EPM7256BFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

188.7 MHz

17 mm

Yes

164

EPM3128AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPF10K10ABC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

150

EPM7128ALBI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPM7128AFC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

144.9 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM7128AFI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

144.9 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM1270GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

212

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.