256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM1270GF256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

980

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM1270GF256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPM2210GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

204

EPF10K50EBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM7128BFC256

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

CMOS

2.5

Grid Array

Macrocell

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

100

EPM570GM256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K30EFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

176

220 °C (428 °F)

17 mm

176

EPM7512AEBC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

163.9 MHz

27 mm

212

EPM7256AEFI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

126.6 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

EPM7512BBC256-10

Altera

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.7 mm

27 mm

No

e0

163.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF10K100EBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K50EBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K100EFC256-2X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM1270GF256I5N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPF10K100BFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

4992 Logic Elements

e0

140 MHz

191

220 °C (428 °F)

17 mm

191

EPM570GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

160

EPM7128AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

116.3 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM2210GF256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM3128AFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPM3512AFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 208 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

30 s

260 °C (500 °F)

17 mm

Yes

208

EPM7256AEFC256-12

Altera

EE PLD

Commercial

Ball

256

TBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Thin Profile

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.1 mm

17 mm

No

e1

100 MHz

17 mm

164

EPM7512AEBC256-10N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

163.9 MHz

27 mm

212

EP1K100FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9 ns

4992

Yes

2.625 V

CMOS

333

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

333

220 °C (428 °F)

17 mm

186

EPM7256AFI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

156.3 MHz

220 °C (428 °F)

17 mm

Yes

164

EP1K30FC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

30 s

171

260 °C (500 °F)

17 mm

171

EPM7512BFI256-10N

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

512

CMOS

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

1.27 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

Yes

EPF6024ABC256-1

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 218 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 24000 Logic Gates

e0

172 MHz

20 s

218

220 °C (428 °F)

27 mm

218

EP1K10FC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

136

220 °C (428 °F)

17 mm

136

EPF10K100EFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPF6024AFC256-3

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

133 MHz

20 s

219

220 °C (428 °F)

17 mm

219

EPM7256EWM883B-20

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

38535Q/M;38534H;883B

2.5

3.3/5,5 V

Grid Array

QFP208,1.2SQ,20

Programmable Logic Devices

No

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 0 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

188.7 MHz

220 °C (428 °F)

27 mm

No

0

EPM570GF256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

440

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM7128AEFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

98 MHz

20 s

220 °C (428 °F)

17 mm

Yes

100

EPM7256BFI256

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 164 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

164

EPF10K50SFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPF6024ABC256-3N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 218 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Can Also Be Used 24000 Logic Gates

e1

133 MHz

27 mm

218

EPM7512BFC256-10N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3.5 mm

17 mm

No

e1

163.9 MHz

17 mm

Yes

212

EPM7256ABI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells

e1

166.7 MHz

27 mm

164

EP1K100FC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

30 s

186

260 °C (500 °F)

17 mm

186

EPM7128ABC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

100 MHz

27 mm

100

EPM1270F256A4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM7064BFI256-7

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

135.1 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM7128BFC256-4

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

243.9 MHz

20 s

220 °C (428 °F)

17 mm

Yes

100

EPM1270GM256I3N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs, 212 I/O

0

Tin/Silver/Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

40 s

260 °C (500 °F)

Yes

212

EPM1270GM256C5

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

10 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPM7512BFI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3.5 mm

17 mm

No

e1

163.9 MHz

17 mm

Yes

212

EP1K50FC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

20 s

186

220 °C (428 °F)

17 mm

186

EPF10K30AFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

17 mm

191

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.