256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM7192EGM883B-20

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

20 ns

Yes

2.625 V

192

CMOS

38535Q/M;38534H;883B

2.5

3.3/5,5 V

Grid Array

PGA160M,15X15

Programmable Logic Devices

No

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

No

EPM7064BFI256-3

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

3.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

277.8 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM7512BFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

163.9 MHz

220 °C (428 °F)

17 mm

Yes

212

EPF10K50EFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

2880 Logic Elements

e0

140 MHz

20 s

191

220 °C (428 °F)

17 mm

191

EPF10K50EFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8.5 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPM1270GF256I4N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

212

EPF10K100EBC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM2210GF256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

204

EPF10K50EFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

2880 Logic Elements

e1

140 MHz

17 mm

191

EPF10K50SFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM570GM256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF6016AFI256-3

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 171 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

133 MHz

171

220 °C (428 °F)

17 mm

171

EPF10K50SFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

191

17 mm

191

EPM7384AEBI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

384 Macrocells

e1

166.7 MHz

27 mm

212

EPF6016BC256-3

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

5.25 V

CMOS

204

5

3.3/5,5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 16000 Logic Gates

e0

133 MHz

20 s

204

220 °C (428 °F)

27 mm

204

EPF6016AFC256-2N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

153 MHz

17 mm

171

EPM7128ALBI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPM2210GF256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPM3128AFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

30 s

260 °C (500 °F)

17 mm

Yes

98

EPM1270GF256A4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EP1K100FC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

186

220 °C (428 °F)

17 mm

186

EPM7256ABI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells

e1

100 MHz

27 mm

164

EPM7256BFC256

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

CMOS

2.5

Grid Array

Macrocell

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

164

EPM7064AEFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 68 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

135.1 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM7192EGM883B-15

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

15 ns

Yes

2.625 V

192

CMOS

38535Q/M;38534H;883B

2.5

3.3/5,5 V

Grid Array

PGA160M,15X15

Programmable Logic Devices

No

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

No

EPF10K30AFC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

17 mm

191

EP1K30FC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

20 s

171

220 °C (428 °F)

17 mm

171

EPM7512BFC256

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

CMOS

2.5

Grid Array

Macrocell

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

212

EPM7256AEBI256-5

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

172.4 MHz

27 mm

212

EPM2210GF256C5

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

204

EP1K50FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 186 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

186

220 °C (428 °F)

17 mm

186

EPM1270M256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

6.2 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

212

EPM570GM256C4

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

7 ns

Yes

440

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EP1K50FC256

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 186 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

186

EPM1270M256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

212

EPF6024AFI256-2

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 219 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

219

220 °C (428 °F)

17 mm

219

EPF10K30AFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

1728

Yes

3.6 V

CMOS

191

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e1

80 MHz

30 s

191

260 °C (500 °F)

17 mm

191

EP1K100FC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

30 s

186

260 °C (500 °F)

17 mm

186

EPM570F256I4N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

160

EPM7512BBC256

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1.27 mm

4 Dedicated Inputs, 212 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

212

EPF10K30EBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.9 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 176 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPF10K30ABI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

1.3 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM7128ABC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

125 MHz

27 mm

100

EPM7128AEFC256-5N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

192.3 MHz

245 °C (473 °F)

17 mm

100

EPM570GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

160

EPM570F256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

440

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM7256AFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

93.5 MHz

220 °C (428 °F)

17 mm

Yes

164

EPF10K50SFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.