256 Programmable Logic Devices (PLD) 694

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM1270GM256I5	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	10 ns		Yes		980	CMOS				1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EPF10K10ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPM7256AEFI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	126.6 MHz	20 s		220 °C (428 °F)	17 mm	Yes	164
EPF10K30EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V		CMOS		176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm		176
EPM570GF256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	160
EPF6016AFC256-3	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS		171	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	133 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EPM7128BFI256-10N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		128	CMOS				1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPM1270GM256A4N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPF10K100BBC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes								Grid Array				Mixed		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPM7512AEFI256-12N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	71.9 MHz			245 °C (473 °F)	17 mm		212
EPM7256AFI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	125 MHz			220 °C (428 °F)	17 mm	Yes	164
5M2210ZF256A5N	Altera	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS	AEC-Q100			1.8,1.2/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256				No								Yes
EPM7512BFC256-5	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0	163.9 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPF6024AFI256-3	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS		219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm		4 Dedicated Inputs, 219 I/O	4		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	133 MHz		219	220 °C (428 °F)	17 mm		219
EPM3256AFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 161 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	161
EPF6024ABC256-3	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS		218	3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 218 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Can Also Be Used 24000 Logic Gates	e0	133 MHz	20 s	218	220 °C (428 °F)	27 mm		218
EPM7256AEFI256-12	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.1 mm	17 mm	No		e1	100 MHz				17 mm		164
EPM7256AFC256-12	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	78.1 MHz			220 °C (428 °F)	17 mm	Yes	164
EP1K50FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.625 V		CMOS		186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			186	220 °C (428 °F)	17 mm		186
EPF6016ABC256-2	Altera	Loadable PLD		Ball	256	BGA		Plastic/Epoxy			Yes			CMOS		204		3.3,3.3/5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays									Tin Lead	Bottom					No		e0			204	220 °C (428 °F)
EPM3256AFC256-10N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 161 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1					17 mm		161
EPM2210GF256A5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS				1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPF10K10ABI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	3.6 V					3.3		Grid Array				Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPF10K50SFC256-1X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.3 ns	2880	Yes	2.625 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EPM7064AEFC256-4	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4.5 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	222.2 MHz			220 °C (428 °F)	17 mm	Yes	68
EPM570M256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EPF6016AFC256-3N	Altera	Loadable PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy			Yes	3.6 V					3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1	133 MHz				17 mm		171
EPM1270GM256C3N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	6.2 ns		Yes	1.89 V	980	CMOS			1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM570F256A5	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes		440	CMOS				1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPM7256AEFI256-6	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS			3.3		Grid Array, Thin Profile				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.1 mm	17 mm	No		e1	166.7 MHz				17 mm		164
EPF10K100BBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes								Grid Array				Mixed		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPF10K100EBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPM7064AEFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	68
EPM7128BFI256-4	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS			2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 100 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	238.1 MHz			220 °C (428 °F)	17 mm	Yes	100
EPF10K50SFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	2880	Yes	2.7 V		CMOS		191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	85 °C (185 °F)	191 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			191	220 °C (428 °F)	17 mm		191
EPF10K30ABI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2 ns	1728	Yes	3.6 V		CMOS		246	3.3	3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1			246	220 °C (428 °F)	27 mm		191
EPM2210F256I3N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS			2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 204 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	17 mm	Yes	204
EPM7512AEBI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	512 Macrocells	e0	71.9 MHz			220 °C (428 °F)	27 mm	Yes	212
EPM7512AEBI256-7N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	512 Macrocells	e1	163.9 MHz				27 mm		212
EPM7064BFC256	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5		Grid Array				Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 68 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		68
EPM3128AFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 98 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	98
EPF10K50EBC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP1K100FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16 ns	4992	Yes	2.625 V		CMOS		333	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 186 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			333	220 °C (428 °F)	17 mm		186
EPF10K30EFI256-3X	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns		Yes	2.7 V		CMOS			2.5		Grid Array				Mixed	2.3 V	1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		176
EPM7128AEFI256-12	Altera	EE PLD	Industrial	Ball	256	TBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	128	CMOS			3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	100
EPF6016BI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1320	Yes	5.5 V		CMOS		204	5	3.3/5,5 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays		Macrocell	4.5 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin Lead	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		204	220 °C (428 °F)	27 mm		218
EP1K10FI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	576	Yes	2.625 V		CMOS		136	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 130 I/O	6	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			136	220 °C (428 °F)	17 mm		130
EPF10K30EBC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.7 V					2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 176 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		176

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.