256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPF10K10AFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

17 mm

150

EPM7512BBC256-5

Altera

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.7 mm

27 mm

No

e0

163.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EPM7512AEBC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

166.7 MHz

27 mm

212

EP1K30FC256

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

70 °C (158 °F)

6 Dedicated Inputs, 171 I/O

6

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

171

EPM570GF256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

160

EPM7512BBC256-7N

Altera

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.7 mm

27 mm

No

e1

163.9 MHz

27 mm

Yes

212

EPM7512AEFC256-12

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

71.9 MHz

20 s

220 °C (428 °F)

17 mm

Yes

212

EPM570GF256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

440

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EP1K30FI256-2N

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

171 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

30 s

171

260 °C (500 °F)

17 mm

171

EPF10K30EFC256-3X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

176

EPF10K50SFC256-2X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM570M256I4N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K100EFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM570GF256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM7128AFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

116.3 MHz

220 °C (428 °F)

17 mm

Yes

100

EPF6024ABC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 218 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 24000 Logic Gates

e0

153 MHz

20 s

218

220 °C (428 °F)

27 mm

218

EPM2210GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 204 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

204

EPM3512AFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 208 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

208

EPF6024ABI256-3

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

133 MHz

218

220 °C (428 °F)

27 mm

218

EPF10K50EFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

2880 Logic Elements

e1

140 MHz

191

17 mm

191

EPM7128ABI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

100 MHz

27 mm

100

EPM7256ABC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells

e1

166.7 MHz

27 mm

164

EPM7256BFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

188.7 MHz

20 s

220 °C (428 °F)

17 mm

Yes

164

EPM7256AEFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

95.2 MHz

20 s

220 °C (428 °F)

17 mm

Yes

164

EPM7512BFI256

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Grid Array

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 212 I/O

4

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

212

EPM570GM256I3N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM1270GM256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

6.2 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

212

EPF10K100EFC256-1X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPF10K50EFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

2880 Logic Elements

e0

140 MHz

20 s

191

220 °C (428 °F)

17 mm

191

EP1K10FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 130 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

136

220 °C (428 °F)

17 mm

130

EPF10K30EFC256-2N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

176

17 mm

176

EPM7128BFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

243.9 MHz

20 s

220 °C (428 °F)

17 mm

Yes

100

5M1270ZF256I5

Altera

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

211 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

201.1 MHz

17 mm

Yes

211

EPF6016BC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

5.25 V

CMOS

204

5

3.3/5,5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

4.75 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 204 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Can Also Be Used 16000 Logic Gates

e0

153 MHz

20 s

204

220 °C (428 °F)

27 mm

204

EPF6024AFC256-1

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172 MHz

219

220 °C (428 °F)

17 mm

219

EPM2210GF256A4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM1270GM256C4

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPF6016AFI256-1

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

4 Dedicated Inputs, 171 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

172 MHz

171

220 °C (428 °F)

17 mm

171

EPF10K50SFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPM7512BBI256-5N

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

512

CMOS

1.8/3.3,2.5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

1.27 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

Yes

EPF10K50SFC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM1270GM256I4

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPF6024AFC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

219

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

20 s

219

220 °C (428 °F)

17 mm

219

EPM7512BBI256-7

Altera

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.7 mm

27 mm

No

e0

119 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF10K30EFC256-1X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

176

220 °C (428 °F)

17 mm

176

EPM2210GF256C3

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

204

EPM2210GF256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPM7128AEFI256-6

Altera

EE PLD

Industrial

Ball

256

TBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.1 mm

17 mm

No

e0

166.7 MHz

220 °C (428 °F)

17 mm

Yes

100

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.