256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM2210GF256C5N

Intel

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

204

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

204

17 mm

Yes

204

XC2C256-6FTG256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

184

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 184 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e1

139 MHz

30 s

184

260 °C (500 °F)

17 mm

Yes

184

5M2210ZF256C5

Intel

Flash PLD

Other

Ball

256

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

203

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

203 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

201.1 MHz

203

17 mm

Yes

203

XC2C384-7FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

384

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

112 MHz

30 s

212

225 °C (437 °F)

17 mm

Yes

212

XC2C256-7FT256I

Xilinx

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

CMOS

184

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 184 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e0

108 MHz

30 s

184

225 °C (437 °F)

17 mm

Yes

184

EP1K30FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

171

17 mm

171

EP1K50FC256-2

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

186

17 mm

186

XC2C512-10FTG256I

Xilinx

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

91 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

EP1K50FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

186

17 mm

186

XC2C512-7FTG256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

119 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

EP1K100FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

186

17 mm

186

EPM570GF256C5N

Intel

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

160

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

160

17 mm

Yes

160

EPM7512AEFC256-7

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

116.3 MHz

20 s

220 °C (428 °F)

17 mm

Yes

212

XC2C512-10FTG256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

91 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

XC2C512-7FTG256I

Xilinx

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

119 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

XC95288XL-7FG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XCR3512XL-10FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

97 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

EP1K10FC256-3

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

136

17 mm

136

EPM1270F256C3N

Intel

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

2.625 V

980

CMOS

212

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

212

260 °C (500 °F)

17 mm

Yes

212

EPM570GF256I5N

Intel

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

160

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

160

17 mm

Yes

160

EPM7512AEFC256-10

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

87 MHz

20 s

220 °C (428 °F)

17 mm

Yes

212

XCR3512XL-7FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

135 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

CY39100V256B-83BBC

Cypress Semiconductor

Loadable PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

15 ns

Yes

2.7 V

1536

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 180 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.6 mm

17 mm

No

Also operates at 3.3 V nominal supply

e0

17 mm

Yes

180

EP1K50FC256-1N

Intel

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.3 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

186 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

90 MHz

186

17 mm

186

EP1K50FI256-2

Intel

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

186 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

37.5 MHz

186

17 mm

186

EP1K50FI256-2N

Intel

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

2880

Yes

2.625 V

CMOS

186

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

85 °C (185 °F)

186 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

37.5 MHz

186

17 mm

186

EPF6024ABI256-2

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin/Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

153 MHz

30 s

218

220 °C (428 °F)

27 mm

218

EPM1270GF256I5

Intel

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

212

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

212

17 mm

Yes

212

EPM1270GM256C5N

Intel

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

212

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

11 mm

No

It can also operate at 3.3 V

e1

212

11 mm

Yes

212

EPM2210F256A5

Intel

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

204

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

124 °C (255.2 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

17 mm

No

e0

204

17 mm

Yes

204

EPM2210F256C3N

Intel

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

204

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

204

17 mm

Yes

204

EPM2210GF256C3N

Intel

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

1700

CMOS

204

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 204 I/O

0

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

204

260 °C (500 °F)

17 mm

Yes

204

EPM3512AFC256-10N

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 208 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

17 mm

Yes

208

EPM3512AFC256-7

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 208 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

17 mm

Yes

208

EPM7256AEFC256-10N

Intel

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

95.2 MHz

17 mm

Yes

164

ISPLSI5384VE-100LF256I

Lattice Semiconductor

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

67 MHz

30 s

225 °C (437 °F)

17 mm

Yes

192

LC4256V-75FTN256AC

Lattice Semiconductor

EE PLD

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

132

PAD-TYPE

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

83

1 mm

90 °C (194 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

111 MHz

40 s

128

260 °C (500 °F)

17 mm

Yes

128

LC4512V-5FTN256C

Lattice Semiconductor

EE PLD

Ball

256

LBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

512

212

PAD-TYPE

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

83

1 mm

90 °C (194 °F)

4 Dedicated Inputs, 208 I/O

4

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

156 MHz

40 s

208

260 °C (500 °F)

17 mm

Yes

208

LC4512V-75FT256C

Lattice Semiconductor

EE PLD

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

212

PAD-TYPE

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

83

1 mm

90 °C (194 °F)

4 Dedicated Inputs, 208 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

111 MHz

30 s

208

225 °C (437 °F)

17 mm

Yes

208

LC5256MV-75FN256C

Lattice Semiconductor

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

0 Dedicated Inputs, 141 I/O

0

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

40 s

250 °C (482 °F)

17 mm

Yes

141

M4A3-384/192-10FANC

Lattice Semiconductor

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

PAL-TYPE

3.3

3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

62.5 MHz

40 s

250 °C (482 °F)

17 mm

Yes

192

XC2C256-7FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

256

CMOS

184

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 184 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e0

108 MHz

30 s

184

225 °C (437 °F)

17 mm

Yes

184

XC2C512-7FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

119 MHz

30 s

212

225 °C (437 °F)

17 mm

Yes

212

XC95288XL-10FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

100 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XCR3512XL-12FTG256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

77 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

PZ3320N8YY

NXP Semiconductors

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

3.63 V

CMOS

3.3

Grid Array

Macrocell

2.97 V

85 °C (185 °F)

192 I/O

-40 °C (-40 °F)

Bottom

S-PBGA-B256

No

91 MHz

192

PZ3320C7YY

NXP Semiconductors

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

9 ns

Yes

3.63 V

CMOS

3.3

Grid Array

Macrocell

2.97 V

70 °C (158 °F)

192 I/O

0 °C (32 °F)

Bottom

S-PBGA-B256

No

100 MHz

192

CY37384P256-66BGC

Infineon Technologies

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

384

CMOS

3.3/5,5 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B256

27 mm

No

e0

47.6 MHz

27 mm

Yes

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.