256 Programmable Logic Devices (PLD) 694

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M570ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	118.3 MHz	30 s		260 °C (500 °F)	17 mm	Yes	159
EPM2210F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM1270F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
5M2210ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz		203		17 mm	Yes	203
EPM1270F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM2210F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
XC2C256-7FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
5M2210ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz	30 s	203	260 °C (500 °F)	17 mm	Yes	203
5M1270ZF256C5N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
EPM570F256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS		160		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
EPM1270M256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
5M1270ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	211 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	201.1 MHz				17 mm	Yes	211
5M2210ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz		203		17 mm	Yes	203
XC2C256-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	256	CMOS		184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 184 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e1	108 MHz	30 s	184	260 °C (500 °F)	17 mm	Yes	184
EPM1270M256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
XC95288XL-7FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	125 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
EPM570ZM256C6N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		160		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			160		11 mm	Yes	160
XC2C384-10FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
EPM570F256I5N	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	2.625 V	440	CMOS		160		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
EPM570F256C3	Intel	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		160		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			160		17 mm	Yes	160
5M570ZF256I5N	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	159 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	118.3 MHz				17 mm	Yes	159
EP1K30FC256-1N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		171		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	90 MHz		171		17 mm		171
EPM1270F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		212		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			212		17 mm	Yes	212
LC4256V-3FTN256BC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256			164	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 160 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	212 MHz	40 s	160	260 °C (500 °F)	17 mm	Yes	160
LC4256V-5FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256			132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	156 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
XC95288XL-10FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-6FG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	208.3 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
5M1270ZF256A5N	Intel	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic	10 ns		Yes	1.89 V	980	CMOS	AEC-Q100				1.8,1.2/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes		1.71 V		1 mm	105 °C (221 °F)	0 Dedicated Inputs, 211 I/O		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No							17 mm	Yes
EPM2210F256C4N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
XC95288XL-6FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	208.3 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
XC95288XL-7BGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	125 MHz	30 s	192	250 °C (482 °F)	27 mm	Yes	192
LC4512V-75FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512			212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	111 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
XC2C384-10FTG256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	83 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
XC95288XL-10FGG256C	Xilinx	Flash PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 192 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	17 mm	Yes	192
CY37512P256-100BGI	Cypress Semiconductor	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	512	CMOS				5	3.3/5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 197 I/O	1	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V	e0	80 MHz				27 mm	Yes	197
5M1270ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	247.5 MHz				17 mm	Yes	211
5M2210ZF256I5	Intel	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	100 °C (212 °F)	203 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
5M2210ZF256C4	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS		203		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	247.5 MHz		203		17 mm	Yes	203
5M570ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V		1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	184.1 MHz				17 mm	Yes	159
CY37512VP256-83BGC	Cypress Semiconductor	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	512	CMOS				3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	70 °C (158 °F)	1 Dedicated Inputs, 197 I/O	1	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.46 mm	27 mm	No	512 Macrocells	e0	62.5 MHz				27 mm	Yes	197
EP1K30FC256-2N	Intel	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS		171		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	70 °C (158 °F)	171 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		171		17 mm		171
EPM7512AEFC256-12N	Intel	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e1	71.9 MHz				17 mm	Yes	212
EPM7512AEFI256-10	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	87 MHz	20 s		220 °C (428 °F)	17 mm	Yes	212
EPM7512AEFI256-10N	Intel	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	512	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	87 MHz				17 mm	Yes	212
EP1K100FI256-2N	Intel	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		186		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz		186		17 mm		186
EPM1270GM256I5N	Intel	Flash PLD		Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		212		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM2210F256A5N	Intel	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	125 °C (257 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210F256I5	Intel	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	2.625 V	1700	CMOS		204		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V		1 mm	100 °C (212 °F)	0 Dedicated Inputs, 204 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0			204		17 mm	Yes	204

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.