256 Programmable Logic Devices (PLD) 694

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XCR3256XL-10FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

105 MHz

30 s

225 °C (437 °F)

17 mm

Yes

164

XCR3384XL-7FTG256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

135 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

XCR3256XL-7FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

154 MHz

30 s

225 °C (437 °F)

17 mm

Yes

164

XC2C384-10FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

83 MHz

30 s

212

225 °C (437 °F)

17 mm

Yes

212

XC2C256-5FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5 ns

Yes

1.9 V

256

CMOS

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 184 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e0

30 s

225 °C (437 °F)

17 mm

Yes

184

XCR3384XL-10FT256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

102 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

XCR3256XL-12FTG256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

256

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

88 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

XCR3512XL-10FT256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

97 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

XC95288XL-10BGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

100 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XCR3384XL-12FT256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

83 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

XCR3512XL-12FT256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

17 mm

Yes

212

XC95288XV-10FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XC95288XL-7BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

125 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XCR3320-10BG256C

Xilinx

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

320

CMOS

3.3

3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

12 Dedicated Inputs, 3 I/O

12

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

87 MHz

30 s

225 °C (437 °F)

27 mm

Yes

3

XC95288XV-7FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

125 MHz

30 s

260 °C (500 °F)

17 mm

Yes

192

XC95288XV-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

225 °C (437 °F)

17 mm

Yes

192

XCR3384XL-10FTG256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

102 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

XCR3512XL-10FTG256I

Xilinx

EE PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

97 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

XCR3256XL-12FTG256C

Xilinx

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

88 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

EPM1270F256I3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

6.2 ns

Yes

980

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM7128BFC256

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

CMOS

2.5

Grid Array

Macrocell

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

100

EPM570GM256A3N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K30EFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

1728

Yes

2.625 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

176 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

176

220 °C (428 °F)

17 mm

176

EPM7512AEBC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

163.9 MHz

27 mm

212

EPM7256AEFI256-7N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

126.6 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

EPM7512BBC256-10

Altera

EE PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Low Profile

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

2.375 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.7 mm

27 mm

No

e0

163.9 MHz

220 °C (428 °F)

27 mm

Yes

212

EPF10K100EBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K50EBI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K100EFC256-2X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM1270GF256I5N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 212 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPF10K100BFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

4992 Logic Elements

e0

140 MHz

191

220 °C (428 °F)

17 mm

191

EPM570GF256I3N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

245 °C (473 °F)

17 mm

Yes

160

EPM7128AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

116.3 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM2210GF256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM3128AFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPM3512AFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 208 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

30 s

260 °C (500 °F)

17 mm

Yes

208

EPM7256AEFC256-12

Altera

EE PLD

Commercial

Ball

256

TBGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array, Thin Profile

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

1.1 mm

17 mm

No

e1

100 MHz

17 mm

164

EPM7512AEBC256-10N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

163.9 MHz

27 mm

212

EPM1270F256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

212

EPM570F256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM7128AFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K50SFC256-3X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K30ABI256

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

189

EPF10K30EFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

176

220 °C (428 °F)

17 mm

176

EPF10K50SFI256-3X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K100BBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

Grid Array

Mixed

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF6024AFC256-2N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

153 MHz

17 mm

219

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.