256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM570GF256C3N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

160

EP1K30FI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 171 I/O

6

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

171

220 °C (428 °F)

17 mm

171

EPF10K100EFI256-2X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K30ABI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

1.5 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM570ZM256C7N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

15.1 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPM7256ABI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells

e1

125 MHz

27 mm

164

EPF6024AFC256-3N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

133 MHz

17 mm

219

EPM570GM256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM7128AEFC256-6

Altera

EE PLD

Commercial

Ball

256

TBGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.1 mm

17 mm

No

e0

166.7 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM7128ALBC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

No

e0

220 °C (428 °F)

Yes

EPM7128AEFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

129.9 MHz

20 s

220 °C (428 °F)

17 mm

Yes

100

EPM7512BFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

2.625 V

512

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

163.9 MHz

220 °C (428 °F)

17 mm

Yes

212

EPF10K50EBC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM7128AEFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

129.9 MHz

220 °C (428 °F)

17 mm

Yes

100

EPF10K100BFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPM7256ABC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

200 MHz

27 mm

164

EPM1270GF256I4

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

980

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EP1K10FC256-1N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

576

Yes

2.625 V

CMOS

136

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

136 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

90 MHz

30 s

136

260 °C (500 °F)

17 mm

136

EPM7064BFC256-7

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.625 V

64

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

4 Dedicated Inputs, 68 I/O

4

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

135.1 MHz

220 °C (428 °F)

17 mm

Yes

68

EPM7128AFI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

72.5 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM2210F256I3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM570GF256C3

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPF10K100EFC256-1XN

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPM7256AEBC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

172.4 MHz

27 mm

212

EPF10K30AFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

246

220 °C (428 °F)

17 mm

191

EPM7256BFI256-5

Altera

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

2.625 V

256

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

0 Dedicated Inputs, 164 I/O

0

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

188.7 MHz

220 °C (428 °F)

17 mm

Yes

164

EPM7128AEFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

98 MHz

220 °C (428 °F)

17 mm

Yes

100

EPM570M256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPF10K10ABC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

150

EPM2210GF256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 204 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

17 mm

Yes

204

EPM7384AEBC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

384 Macrocells

e1

166.7 MHz

220 °C (428 °F)

27 mm

212

EPF10K10AFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

17 mm

150

EPF10K10AFI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

16 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Registered

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 150 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

150

EPM570GM256A5N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K10AFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

17 mm

150

EPM570F256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

160

EPF10K100BBC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

Grid Array

Mixed

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM570GM256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM3256AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 161 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

161

EPM1270F256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EPF10K30ABC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

1.3 ns

1728

Yes

3.6 V

CMOS

246

3.3

3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

246

220 °C (428 °F)

27 mm

191

EPM2210GF256I3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1700

CMOS

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPM570ZM256A7N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

15.1 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF10K30EBC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.6 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 176 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPM7384AEBI256-12

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

384 Macrocells

e1

100 MHz

27 mm

212

EPM2210GF256I5N

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

0 Dedicated Inputs, 204 I/O

0

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

204

EPM7256AEFI256-5N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

172.4 MHz

245 °C (473 °F)

17 mm

164

5M1270ZF256C4

Altera

Flash PLD

Other

Ball

256

LBGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

211 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

247.5 MHz

17 mm

Yes

211

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.