256 Programmable Logic Devices (PLD) 694

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K10AFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V		CMOS	150	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm		150
EPF10K10AFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Registered	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		150
EPM570GM256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EPF10K10AFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns	576	Yes	3.6 V		CMOS	150	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays		Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm		150
EPM570F256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	160
EPF10K100BBC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes							Grid Array				Mixed		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EPM570GM256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	7 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EPM3256AFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 161 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0		20 s		220 °C (428 °F)	17 mm	Yes	161
EPM1270F256C4N	Altera	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.1 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	212
EPF10K30ABC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	1.3 ns	1728	Yes	3.6 V		CMOS	246	3.3	3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1			246	220 °C (428 °F)	27 mm		191
EPM2210GF256I3	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes		1700	CMOS			1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPM570ZM256A7N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	15.1 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EPF10K30EBC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V				2.5		Grid Array				Mixed	2.3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 176 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		176
EPM7384AEBI256-12	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	384 Macrocells	e1	100 MHz				27 mm		212
EPM2210GF256I5N	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm		0 Dedicated Inputs, 204 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	17 mm	Yes	204
EPM7256AEFI256-5N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	172.4 MHz			245 °C (473 °F)	17 mm		164
5M1270ZF256C4	Altera	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8.1 ns		Yes	1.89 V	980	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	247.5 MHz				17 mm	Yes	211
EPM7128AFC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,50	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V	e0	87 MHz			220 °C (428 °F)	17 mm	Yes	100
EPM1270M256A5N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	2.625 V	980	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	212
EPM570GM256C3	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EPM2210F256C4	Altera	Flash PLD	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e0		20 s		220 °C (428 °F)	17 mm	Yes	204
EPM7128ALBI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes		128	CMOS			2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256				No		e0				220 °C (428 °F)		Yes
EP1K50FC256-2N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	37.5 MHz	30 s	186	260 °C (500 °F)	17 mm		186
EPF10K100EFC256-3X	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.7 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Mixed	2.375 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		191
EPM7512BFC256-6	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 212 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	147.1 MHz			220 °C (428 °F)	17 mm	Yes	212
EPM7512BFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5.5 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e0	163.9 MHz			220 °C (428 °F)	17 mm	Yes	212
EPF10K30ABC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	1.5 ns	1728	Yes	3.6 V		CMOS	246	3.3	3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 191 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1			246	220 °C (428 °F)	27 mm		191
EPM7128BFC256-10N	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 100 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		3.5 mm	17 mm	No		e1	243.9 MHz				17 mm	Yes	100
EPM570GF256I3	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPF10K50EFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns	2880	Yes	2.7 V		CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	2880 Logic Elements	e0	140 MHz	20 s	191	220 °C (428 °F)	17 mm		191
EP1K50FC256-3N	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns	2880	Yes	2.625 V		CMOS	186	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	186 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1		30 s	186	260 °C (500 °F)	17 mm		186
EPM2210F256A4	Altera	Flash PLD		Ball	256	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS			1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B256	1			No		e0						Yes
EPM7512BBI256-10	Altera	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	512	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.7 mm	27 mm	No		e0	90.1 MHz			220 °C (428 °F)	27 mm	Yes	212
EPM570F256A3N	Altera	Flash PLD	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS		2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.2 mm	17 mm	No	It can also operate at 3.3 V	e1					17 mm	Yes	160
5M1270ZF256C5	Altera	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	211 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz				17 mm	Yes	211
EPM7384AEBC256-12	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	384 Macrocells	e1	100 MHz			220 °C (428 °F)	27 mm		212
EPM7256BFI256-10	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	256	CMOS		2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 164 I/O	0		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	94.3 MHz			220 °C (428 °F)	17 mm	Yes	164
EP1K30FI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	171	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,50	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	85 °C (185 °F)	171 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	37.5 MHz	20 s	171	220 °C (428 °F)	17 mm		171
EPM7064AEFC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 68 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	100 MHz			220 °C (428 °F)	17 mm	Yes	68
EPM7384AEFI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		384	CMOS			2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes			1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0				220 °C (428 °F)		Yes
EPM570ZM256A6N	Altera	Flash PLD	Automotive	Ball	256	BGA	Rectangular	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 160 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256				No	It can also operate at 3.3 V	e1						Yes	160
EPF10K30EFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	176	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.375 V	1 mm	70 °C (158 °F)	176 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0		20 s	176	220 °C (428 °F)	17 mm		176
EPM7512BBI256-10N	Altera	EE PLD		Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		512	CMOS			1.8/3.3,2.5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes			1.27 mm					Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPM3128AFI256-10N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 98 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm	Yes	98
EPF10K100BBI256-2	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes							Grid Array				Mixed		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 191 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		191
EP1K30FI256	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy			Yes	2.625 V				2.5		Grid Array				Registered	2.375 V	1 mm	85 °C (185 °F)	6 Dedicated Inputs, 171 I/O	6	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.1 mm	17 mm	No		e1					17 mm		171
EPM570GM256I3	Altera	Flash PLD		Ball	256	FBGA	Square	Plastic/Epoxy	5.4 ns		Yes		440	CMOS			1.8,1.8/3 V	Grid Array, Fine Pitch	BGA256,20X20,20	Programmable Logic Devices	Yes			.5 mm						Bottom	S-PBGA-B256				No								Yes
EPM7128ABI256-6	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V		CMOS		3.3		Grid Array				Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	128 Macrocells	e1	166.7 MHz				27 mm		100

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.