256 Programmable Logic Devices (PLD) 694

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM3128AFI256-10N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 98 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e1

30 s

260 °C (500 °F)

17 mm

Yes

98

EPF10K100BBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

Grid Array

Mixed

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EP1K30FI256

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Registered

2.375 V

1 mm

85 °C (185 °F)

6 Dedicated Inputs, 171 I/O

6

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

171

EPM570GM256I3

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

5.4 ns

Yes

440

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPM7128ABI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

166.7 MHz

27 mm

100

EPF10K30AFC256-2

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Registered

3 V

1 mm

70 °C (158 °F)

4 Dedicated Inputs, 191 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

20 s

246

220 °C (428 °F)

17 mm

191

EPM1270GM256C3

Altera

Flash PLD

Ball

256

FBGA

Square

Plastic/Epoxy

6.2 ns

Yes

980

CMOS

1.8,1.8/3 V

Grid Array, Fine Pitch

BGA256,20X20,20

Programmable Logic Devices

Yes

.5 mm

Bottom

S-PBGA-B256

No

Yes

EPM7256AEFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

126.6 MHz

30 s

260 °C (500 °F)

17 mm

Yes

164

EPM7128AFI256-10

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

87 MHz

220 °C (428 °F)

17 mm

Yes

100

EPF10K50EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF10K30ABI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

1.3 ns

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPM7128ABC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

125 MHz

27 mm

100

EPM7128AEFC256-5N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

192.3 MHz

245 °C (473 °F)

17 mm

100

EPM570GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

160

EPM570F256A3

Altera

Flash PLD

Ball

256

BGA

Square

Plastic/Epoxy

5.4 ns

Yes

440

CMOS

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

No

e0

Yes

EPM7256AFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

256

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 164 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

93.5 MHz

220 °C (428 °F)

17 mm

Yes

164

EPF10K50SFI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

2880

Yes

2.7 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

191

220 °C (428 °F)

17 mm

191

EPM570GF256C5

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

1.89 V

440

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

5M570ZF256I5

Altera

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

17.7 ns

Yes

1.89 V

440

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

159 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e0

118.3 MHz

17 mm

Yes

159

EPF10K100EFC256-3N

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

191

17 mm

191

EPM7128BFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4 ns

Yes

2.625 V

128

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3.5 mm

17 mm

No

e1

243.9 MHz

17 mm

Yes

100

EPM570F256C5

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM7256ABI256-6

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 164 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

200 MHz

27 mm

164

EP1K30FC256-1

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.4 ns

1728

Yes

2.625 V

CMOS

171

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,50

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

171 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

90 MHz

20 s

171

220 °C (428 °F)

17 mm

171

EPF6016BI256-3

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

5.5 V

CMOS

204

5

3.3/5,5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

4.5 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin Lead

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

133 MHz

204

220 °C (428 °F)

27 mm

218

EPF10K30EBI256-2

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

2.7 V

2.5

Grid Array

Mixed

2.3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 176 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

176

EPM570M256A4N

Altera

Flash PLD

Automotive

Ball

256

BGA

Rectangular

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

125 °C (257 °F)

0 Dedicated Inputs, 160 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPM7384AEFI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

384

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF6016AFC256-2

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 171 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

153 MHz

171

220 °C (428 °F)

17 mm

171

EPM7512AEBI256-10N

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

512 Macrocells

e1

163.9 MHz

27 mm

212

EPM7512AEBC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e0

163.9 MHz

20 s

220 °C (428 °F)

27 mm

Yes

212

EPM7128ABI256-7

Altera

EE PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 100 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

166.7 MHz

27 mm

100

EPF10K100EFC256-3

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

4992

Yes

2.625 V

CMOS

191

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

20 s

191

220 °C (428 °F)

17 mm

191

EPM7512AEFC256-7N

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V

e1

116.3 MHz

30 s

260 °C (500 °F)

17 mm

Yes

212

EPM1270F256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

2.625 V

980

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

212

EPM570F256C4

Altera

Flash PLD

Commercial Extended

Ball

256

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 160 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e0

20 s

220 °C (428 °F)

17 mm

Yes

160

EPM7128AFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

128

CMOS

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,50

Programmable Logic Devices

Yes

1.27 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

220 °C (428 °F)

Yes

EPF10K50SFC256-3X

Altera

Loadable PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

0.5 ns

Yes

2.625 V

CMOS

2.5

Grid Array

Mixed

2.375 V

1 mm

70 °C (158 °F)

191 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K30ABI256

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Mixed

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

189

EPF10K30EFI256-1

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

8 ns

1728

Yes

2.7 V

CMOS

176

2.5

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

Mixed

2.3 V

1 mm

85 °C (185 °F)

176 I/O

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e0

176

220 °C (428 °F)

17 mm

176

EPF10K50SFI256-3X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

12.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPF10K100BBI256-3

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

0.7 ns

Yes

Grid Array

Mixed

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 191 I/O

4

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

e1

27 mm

191

EPF6024AFC256-2N

Altera

Loadable PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

3.3

Grid Array

Macrocell

3 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 219 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

153 MHz

17 mm

219

EPF10K50SFI256-2X

Altera

Loadable PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

2.7 V

CMOS

2.5

Grid Array

Mixed

2.3 V

1 mm

85 °C (185 °F)

191 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.1 mm

17 mm

No

e1

17 mm

191

EPM570M256I5N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

8.7 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

3

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

Yes

160

EPM570M256I3N

Altera

Flash PLD

Ball

256

BGA

Rectangular

Plastic/Epoxy

5.4 ns

Yes

2.625 V

440

CMOS

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA256,20X20,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

0 Dedicated Inputs, 160 I/O

0

Tin Silver Copper

Bottom

R-PBGA-B256

No

It can also operate at 3.3 V

e1

Yes

160

EPF6016ABC256-3

Altera

Loadable PLD

Ball

256

BGA

Plastic/Epoxy

Yes

CMOS

204

3.3,3.3/5 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Tin Lead

Bottom

No

e0

204

220 °C (428 °F)

EPM7128ABC256-6

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

2.3 mm

27 mm

No

128 Macrocells

e1

166.7 MHz

27 mm

100

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.