Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Total Dose (V) | Maximum Supply Voltage | No. of Functions | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Gain | Minimum Operating Temperature | Terminal Finish | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
3200 MHz |
4000 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
LDMOS |
1 |
25 dBm |
10 |
COMPONENT |
50 |
50 ohm |
150 Cel |
30.5 dB |
-55 Cel |
TIN |
e3 |
1030 MHz |
1090 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
28 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
27.1 dB |
3700 MHz |
4000 MHz |
||||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
COMPONENT |
2.15/28 |
50 ohm |
150 Cel |
28 dB |
-40 Cel |
TIN |
e3 |
1800 MHz |
2200 MHz |
|||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
LDMOS |
IEC-60134 |
1 |
5 |
COMPONENT |
50 ohm |
200 Cel |
27.5 dB |
TIN |
2100 MHz |
2200 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
18 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
31.5 dB |
-40 Cel |
TIN |
e3 |
1400 MHz |
2200 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
26 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
23 dB |
-40 Cel |
TIN |
e3 |
3400 MHz |
3800 MHz |
||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
TIN |
e3 |
575 MHz |
960 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
29 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
25.4 dB |
NICKEL PALLADIUM GOLD |
e4 |
3600 MHz |
3800 MHz |
||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
26 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
26.1 dB |
NICKEL PALLADIUM GOLD |
I/P POWER-MAX (PEAK)=25DBM |
e4 |
3600 MHz |
3800 MHz |
|||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
27 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
25.6 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3580 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
26 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
23 dB |
-40 Cel |
TIN |
e3 |
3400 MHz |
3800 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
26 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
26.5 dB |
I/P POWER-MAX (PEAK)=25DBM |
3300 MHz |
3700 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
TIN |
e3 |
2400 MHz |
3100 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
TIN |
e3 |
3200 MHz |
4000 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
3200 MHz |
4000 MHz |
||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
COMPONENT |
2.15/28 |
50 ohm |
150 Cel |
28 dB |
-40 Cel |
1800 MHz |
2200 MHz |
|||||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
TIN |
e3 |
575 MHz |
960 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
LDMOS |
IEC-60134 |
1 |
5 |
COMPONENT |
50 ohm |
200 Cel |
27.5 dB |
TIN |
2100 MHz |
2200 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
30 |
LCC26,.24X.4,40 |
50 ohm |
125 Cel |
29.3 dB |
NICKEL PALLADIUM GOLD |
e4 |
3400 MHz |
3700 MHz |
||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
TIN |
e3 |
2400 MHz |
3100 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
18 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
31.5 dB |
-40 Cel |
TIN |
e3 |
1400 MHz |
2200 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
COMPONENT |
2.15/28 |
50 ohm |
150 Cel |
28 dB |
-40 Cel |
1800 MHz |
2200 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
26 |
PLASTIC/EPOXY |
LDMOS |
1 |
COMPONENT |
28 |
LCC26,.24X.4,20 |
50 ohm |
125 Cel |
32 dB |
I/P POWER-MAX (PEAK)=25DBM |
2300 MHz |
2400 MHz |
|||||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
7 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
COMPONENT |
2.15/28 |
50 ohm |
150 Cel |
28 dB |
-40 Cel |
TIN |
e3 |
1800 MHz |
2200 MHz |
|||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
LDMOS |
1 |
25 dBm |
10 |
COMPONENT |
50 |
50 ohm |
150 Cel |
30.5 dB |
-55 Cel |
TIN |
e3 |
1030 MHz |
1090 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
LDMOS |
1 |
25 dBm |
10 |
COMPONENT |
50 |
50 ohm |
150 Cel |
30.5 dB |
-55 Cel |
Tin (Sn) |
e3 |
1030 MHz |
1090 MHz |
||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
Tin (Sn) |
e3 |
575 MHz |
960 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
2400 MHz |
3100 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
18 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
31.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
1400 MHz |
2200 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
26 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
23 dB |
-40 Cel |
Tin (Sn) |
e3 |
3400 MHz |
3800 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
18 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
31.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
1400 MHz |
2200 MHz |
||||||||
|
NXP Semiconductors |
WIDE BAND HIGH POWER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
LDMOS |
1 |
20 dBm |
10 |
COMPONENT |
48 |
50 ohm |
150 Cel |
35 dB |
-40 Cel |
Tin (Sn) |
e3 |
575 MHz |
960 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
2 |
20 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
30.5 dB |
-40 Cel |
Tin (Sn) |
e3 |
2400 MHz |
3100 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
LDMOS |
1 |
25 dBm |
10 |
COMPONENT |
50 |
50 ohm |
150 Cel |
30.5 dB |
-55 Cel |
Tin (Sn) |
e3 |
1030 MHz |
1090 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
26 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
23 dB |
-40 Cel |
Tin (Sn) |
e3 |
3400 MHz |
3800 MHz |
||||||||
|
NXP Semiconductors |
NARROW BAND HIGH POWER |
SURFACE MOUNT |
17 |
PLASTIC/EPOXY |
LDMOS |
1 |
28 dBm |
10 |
COMPONENT |
28 |
50 ohm |
150 Cel |
26.5 dB |
-40 Cel |
3200 MHz |
4000 MHz |
RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.
The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.
RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.