BUTT Cellphone ICs 52

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e4			1.1 mm
SARA-U201-04B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
SARA-R412M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	BUTT	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	GRID ARRAY		65 Cel	-20 Cel		BOTTOM	R-XBGA-B96	4	2.78 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
SARA-U201-03B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		65 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B6	1
RFFM6903SR	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm			e4	30	260	6 mm
BGSX22G2A10E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B10	1
SARA-U270-03S-01	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	CHIP CARRIER		55 Cel	-20 Cel		BOTTOM	R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
RFFM6903	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm			e4	30	260	6 mm
RFFM6903TR13	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm			e4	30	260	6 mm
RFFM6903TR7	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	28	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V	GRID ARRAY, HEAT SINK/SLUG		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBGA-B28	3	1.05 mm	6 mm			e4	30	260	6 mm
RF3183	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		85 Cel	-30 Cel		BOTTOM	S-PBCC-B11		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
RF3183TR13	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		85 Cel	-30 Cel		BOTTOM	S-PBCC-B11		1 mm	5 mm	Not Qualified					5 mm
STRAFT-P98L15	STMicroelectronics	RF AND BASEBAND CIRCUIT	OTHER	BUTT	15	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1			GRID ARRAY, THIN PROFILE, FINE PITCH	.75 mm	85 Cel	-25 Cel		BOTTOM	R-XBGA-B15		1.1 mm	2.7 mm						3.8 mm
LTE3401LX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm					260	1.1 mm
LTE3401L	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
LTE3401H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
LTE3401HX	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6	1	.4 mm	.7 mm					260	1.1 mm
BGS8L2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
BGS8L5	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
SA3601W	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified					5 mm
BGS8M2	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBCC-B6		.4 mm	.7 mm						1.1 mm
SA3601	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	32	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBCC-B32		.8 mm	5 mm	Not Qualified					5 mm
BGM1143N9E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm						1.5 mm
BGSX22G2A10	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		CHIP CARRIER					BOTTOM	R-XBCC-B10	1
BGM1143N9	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm				NOT SPECIFIED	NOT SPECIFIED	1.5 mm
BGM1143N9E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	8	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B8		.77 mm	1.1 mm						1.5 mm
BGSX22GN10	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	2.6 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B10		.4 mm	1.1 mm						1.5 mm
BGA713L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.4 mm	1.3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA777L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e3			1.1 mm
BGA713N7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.3 mm						2 mm
BGA713L7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7L1BN6	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm			e3			1.1 mm
BGA777L7	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	BUTT	6	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6		.5 mm	1.3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	2 mm
BGA7H1BN6E6327	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.4 mm	.7 mm						1.1 mm
AJAV-5501-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG	.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm					260	3 mm
ACPM-5252-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2412-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER	2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified				260	3.3 mm
ALM-2412-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER	2 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B12	3	1.2 mm	2.5 mm	Not Qualified				260	3.3 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.8 V	GRID ARRAY, HEAT SINK/SLUG	.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm					260	3 mm
ALM-2712-SG1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-5252-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2712-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-7800-TR1	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	42		RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY					QUAD	R-XQMA-B42	3	1 mm	5 mm					260	7 mm
ACPM-5281-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm
ALM-2712-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.7 V	CHIP CARRIER	1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified				260	3 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3.4 V	CHIP CARRIER	.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified		e4		260	5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.