Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
181 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B181 |
2.2 mm |
28.2 mm |
28.2 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G32 |
1 |
2.65 mm |
7.5 mm |
250 |
20.5 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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|
U-blox Ag |
TELECOM CIRCUIT |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Laird Technologies |
TELECOM CIRCUIT |
NO LEAD |
71 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N71 |
2.35 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
BUTT |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
2.9/4.8 |
GRID ARRAY |
LGA100(UNSPEC) |
Other Telecom ICs |
.7 mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
100 Mbps |
R-PBGA-B100 |
3 |
2 mm |
13.3 mm |
Not Qualified |
e4 |
30 |
260 |
13.4 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
QUAD |
S-CQCC-N12 |
3 |
.92 mm |
3 mm |
e4 |
3 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
MATTE TIN |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
e3 |
2 mm |
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|
Qualcomm |
TELECOM CIRCUIT |
BALL |
176 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
HVCMOS |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
BOTTOM |
S-PBGA-B176 |
3 |
.86 mm |
6.2 mm |
6.2 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e4 |
NOT SPECIFIED |
260 |
5 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
18 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC18,.20SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N18 |
1 mm |
5 mm |
Not Qualified |
e4 |
5 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD SILVER |
2 |
e4 |
30 |
260 |
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Intel |
TELECOM CIRCUIT |
NO LEAD |
SMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
80 Cel |
0 Cel |
SINGLE |
867 Mbps |
R-XSMA-N |
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|
Laird Technologies |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
9.7 mm |
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Silicon Labs |
TELECOM CIRCUIT |
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Silicon Labs |
TELECOM CIRCUIT |
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|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Infineon Technologies |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.021 mA |
3 V |
2.1/4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
Other Telecom ICs |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G10 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Codecs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
4 |
1.6 mm |
16-BIT |
7 mm |
Not Qualified |
A/MU-LAW |
e4 |
30 |
260 |
7 mm |
YES |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
9.9 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.016 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
72.2 Mbps |
R-XXMA-N28 |
3 |
2.113 mm |
14.73 mm |
Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps |
21.72 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.8 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-N12 |
1 |
.65 mm |
1.1 mm |
1.9 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1 Mbps |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N33 |
3 |
19 mm |
40 |
250 |
25 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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U-blox Ag |
TELECOM CIRCUIT |
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|
U-blox Ag |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.095 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
107 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N107 |
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Pulse Electronics |
TELECOM CIRCUIT |
MILITARY |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
HYBRID |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SOP28,.5 |
ATM/SONET/SDH ICs |
.65 mm |
125 Cel |
-55 Cel |
DUAL |
R-PDSO-G28 |
1 |
5.588 mm |
Not Qualified |
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|
Wurth Elektronik |
TELECOM CIRCUIT |
3 |
30 |
250 |
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|
Ls Research |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N52 |
4 |
1.9 mm |
13 mm |
18 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.085 mA |
5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
400 Mbps |
S-PQCC-J28 |
3 |
4.572 mm |
11.5316 mm |
Not Qualified |
e3 |
20 |
260 |
11.5316 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
50 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N50 |
2.55 mm |
15.9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
23.9 mm |
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|
Digi International |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
.2 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
4 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.76 mm |
105 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N32 |
3 |
1.9 mm |
9.5 mm |
15.4 mm |
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Lime Microsystems |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
261 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B261 |
11.5 mm |
11.5 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
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|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.9 mm |
5 mm |
Not Qualified |
5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.