TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

LE910C1-EU

Telit Communications Plc

TELECOM CIRCUIT

INDUSTRIAL

BUTT

181

LGA

SQUARE

UNSPECIFIED

YES

1

3.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-XBGA-B181

2.2 mm

28.2 mm

28.2 mm

MFRC53001T/0FE,112

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G32

1

2.65 mm

7.5 mm

250

20.5 mm

MGM240PA22VNA3

Silicon Labs

TELECOM CIRCUIT

NINA-B306-01B

U-blox Ag

TELECOM CIRCUIT

SPBTLE-RFTR

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

451-00002

Laird Technologies

TELECOM CIRCUIT

NO LEAD

71

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N71

2.35 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

PN5321A3HN/C106

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

1 mm

6 mm

e4

30

260

6 mm

WL1805MODGBMOCT

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BUTT

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.7 V

2.9/4.8

GRID ARRAY

LGA100(UNSPEC)

Other Telecom ICs

.7 mm

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

BOTTOM

100 Mbps

R-PBGA-B100

3

2 mm

13.3 mm

Not Qualified

e4

30

260

13.4 mm

HMC773ALC3BTR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N12

3

.92 mm

3 mm

e4

3 mm

LTC5596IDC#TRMPBF

Analog Devices

TELECOM CIRCUIT

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

MATTE TIN

DUAL

S-PDSO-N8

.8 mm

2 mm

e3

2 mm

PM-8916-0-176NSP-TR-02-1-01

Qualcomm

TELECOM CIRCUIT

BALL

176

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

HVCMOS

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

S-PBGA-B176

3

.86 mm

6.2 mm

6.2 mm

SI4432-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

WFM200S022XNA3R

Silicon Labs

TELECOM CIRCUIT

3

40

260

CC2640F128RHBT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N32

3

1 mm

5 mm

e4

NOT SPECIFIED

260

5 mm

MD0101K6-G

Microchip Technology

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

18

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC18,.20SQ,20

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N18

1 mm

5 mm

Not Qualified

e4

5 mm

MFRC63003HNE

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

8265.NGWMG.NV

Intel

TELECOM CIRCUIT

NO LEAD

SMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

80 Cel

0 Cel

SINGLE

867 Mbps

R-XSMA-N

BT740-SA

Laird Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

OPA380AIDGKRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.008 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

PCM3060PWR

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

RS9116W-DB00-CC0-B24

Silicon Labs

TELECOM CIRCUIT

RS9116W-SB00-QMS-B24

Silicon Labs

TELECOM CIRCUIT

STID135-WB

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

TDK5110FHTMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.021 mA

3 V

2.1/4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e3

3 mm

TLV320AIC22CPTR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

2

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Codecs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

4

1.6 mm

16-BIT

7 mm

Not Qualified

A/MU-LAW

e4

30

260

7 mm

YES

TMS3705A1DRG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

1.75 mm

3.9 mm

Not Qualified

e4

30

260

9.9 mm

ATWILC1000-MR110UB

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

1.016 mm

85 Cel

-40 Cel

UNSPECIFIED

72.2 Mbps

R-XXMA-N28

3

2.113 mm

14.73 mm

Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps

21.72 mm

BGM15MA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

1.9 mm

CLRC66302HN,157

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

1 Mbps

S-PQCC-N32

1

1 mm

5 mm

30

260

5 mm

ETRX357

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N33

3

19 mm

40

250

25 mm

NINA-B112-01B

U-blox Ag

TELECOM CIRCUIT

4

NINA-B406-00B

U-blox Ag

TELECOM CIRCUIT

ODIN-W260

U-blox Ag

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

CY7B923-JXI

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.095 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

400 Mbps

S-PQCC-J28

3

4.572 mm

11.5316 mm

Not Qualified

e3

20

260

11.5316 mm

RS9116W-DB00-CC1-X11

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

107

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.85 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-N107

TM266DVA1

Pulse Electronics

TELECOM CIRCUIT

MILITARY

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP28,.5

ATM/SONET/SDH ICs

.65 mm

125 Cel

-55 Cel

DUAL

R-PDSO-G28

1

5.588 mm

Not Qualified

2614011037000

Wurth Elektronik

TELECOM CIRCUIT

3

30

250

450-0064

Ls Research

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N52

4

1.9 mm

13 mm

18 mm

CC430F5135IRGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 Mbps

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CY7B923-JXCT

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.085 mA

5 V

5

CHIP CARRIER

LDCC28,.5SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

400 Mbps

S-PQCC-J28

3

4.572 mm

11.5316 mm

Not Qualified

e3

20

260

11.5316 mm

WT32I-A-AI6

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

NOT SPECIFIED

NOT SPECIFIED

23.9 mm

XB3-24DMUM-J

Digi International

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC1175RHBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.2 Mbps

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

e4

NOT SPECIFIED

260

5 mm

CC2640F128RSMR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

S-PQCC-N32

3

1 mm

4 mm

e4

NOT SPECIFIED

260

4 mm

CYBLE-224116-01

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.76 mm

105 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N32

3

1.9 mm

9.5 mm

15.4 mm

LMS7002M

Lime Microsystems

TELECOM CIRCUIT

INDUSTRIAL

BALL

261

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B261

11.5 mm

11.5 mm

NEO-M8P-0-11

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100; TS 16949

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

16 mm

NRF905-REEL

Nordic Semiconductor Asa

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.9 mm

5 mm

Not Qualified

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.